Thermal interface material and heat sink configuration

Thermal interface materials (TIMs) are critical to protect active semiconductor devices, such as microprocessors, from exceeding the operational temperature limit. They enable bonding of the heat generating device (e.g., a silicon semiconductor) to a heat sink or a heat spreader (e.g, copper and/or...

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Bibliographische Detailangaben

Hauptverfasser:	Sreeram, Attiganal N, Lewis, Brian, Hozer, Leszek, Liberatore, Michael James, Minogue, Gerard
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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