Electronic component having a semiconductor chip

Electronic component having a semiconductor chip

The invention relates to an electronic component having a semiconductor chip comprising a multi-layered coating that includes at least one interconnect layer, one insulation layer, and one planarization layer. An electronic component includes a semiconductor chip and/or a test structure. The semicon...

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Hauptverfasser: Alpern, Peter, Herzog, Thomas, Sauert, Wolfgang, Schauer, Heinz, Tilgner, Rainer
Format: Patent
Sprache:eng
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creator Alpern, Peter
Herzog, Thomas
Sauert, Wolfgang
Schauer, Heinz
Tilgner, Rainer
description The invention relates to an electronic component having a semiconductor chip comprising a multi-layered coating that includes at least one interconnect layer, one insulation layer, and one planarization layer. An electronic component includes a semiconductor chip and/or a test structure. The semiconductor chip includes a multi-layer coating having at least one interconnect layer, at least one insulation layer, and at least one planarization layer. A method of producing the component is also disclosed. Embedded adhesion regions are provided in the planarization layer, whereby the adhesion regions provide adhesion surfaces to the adjacent insulation layers.
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title Electronic component having a semiconductor chip
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