Manufacturing method for attaching components to a substrate

The invention is directed to a chip assembly process, and more particularly to a process for connecting components to a substrate using solder balls and an underfill compound. A method for manufacturing a chip assembly includes the steps of applying a controlled amount of flux to a plurality of sold...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Patterson, Timothy, Hock, Alex Lim Tiang
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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