Manufacturing method for attaching components to a substrate
The invention is directed to a chip assembly process, and more particularly to a process for connecting components to a substrate using solder balls and an underfill compound. A method for manufacturing a chip assembly includes the steps of applying a controlled amount of flux to a plurality of sold...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | Patterson, Timothy Hock, Alex Lim Tiang |
description | The invention is directed to a chip assembly process, and more particularly to a process for connecting components to a substrate using solder balls and an underfill compound.
A method for manufacturing a chip assembly includes the steps of applying a controlled amount of flux to a plurality of solder balls on a die, applying a non-fluxing underfill material to a substrate, and assembling the die and substrate together to form the chip assembly such that the non-fluxing underfill material is trapped in between the die and the substrate. By applying the underfill material to the substrate before the chip is assembled rather than afterward, the inventive method increases chip assembly speed while maintaining control over flux application to prevent the solder balls from collapsing, eliminate the need for a defined solder resist window, and maintain a consistent die-to-substrate clearance at the solder joint. |
format | Patent |
fullrecord | <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_06648213</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>06648213</sourcerecordid><originalsourceid>FETCH-uspatents_grants_066482133</originalsourceid><addsrcrecordid>eNrjZLDxTcwrTUtMLiktysxLV8hNLcnIT1FIyy9SSCwpSUzOAAkm5-cW5Oel5pUUK5TkKyQqFJcmFZcUJZak8jCwpiXmFKfyQmluBgU31xBnD93S4gKgNFBDfHpRIogyMDMzsTAyNDYmQgkA6uQxIw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Manufacturing method for attaching components to a substrate</title><source>USPTO Issued Patents</source><creator>Patterson, Timothy ; Hock, Alex Lim Tiang</creator><creatorcontrib>Patterson, Timothy ; Hock, Alex Lim Tiang ; Saturn Electronics & Engineering, Inc</creatorcontrib><description>The invention is directed to a chip assembly process, and more particularly to a process for connecting components to a substrate using solder balls and an underfill compound.
A method for manufacturing a chip assembly includes the steps of applying a controlled amount of flux to a plurality of solder balls on a die, applying a non-fluxing underfill material to a substrate, and assembling the die and substrate together to form the chip assembly such that the non-fluxing underfill material is trapped in between the die and the substrate. By applying the underfill material to the substrate before the chip is assembled rather than afterward, the inventive method increases chip assembly speed while maintaining control over flux application to prevent the solder balls from collapsing, eliminate the need for a defined solder resist window, and maintain a consistent die-to-substrate clearance at the solder joint.</description><language>eng</language><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6648213$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,802,885,64039</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6648213$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Patterson, Timothy</creatorcontrib><creatorcontrib>Hock, Alex Lim Tiang</creatorcontrib><creatorcontrib>Saturn Electronics & Engineering, Inc</creatorcontrib><title>Manufacturing method for attaching components to a substrate</title><description>The invention is directed to a chip assembly process, and more particularly to a process for connecting components to a substrate using solder balls and an underfill compound.
A method for manufacturing a chip assembly includes the steps of applying a controlled amount of flux to a plurality of solder balls on a die, applying a non-fluxing underfill material to a substrate, and assembling the die and substrate together to form the chip assembly such that the non-fluxing underfill material is trapped in between the die and the substrate. By applying the underfill material to the substrate before the chip is assembled rather than afterward, the inventive method increases chip assembly speed while maintaining control over flux application to prevent the solder balls from collapsing, eliminate the need for a defined solder resist window, and maintain a consistent die-to-substrate clearance at the solder joint.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZLDxTcwrTUtMLiktysxLV8hNLcnIT1FIyy9SSCwpSUzOAAkm5-cW5Oel5pUUK5TkKyQqFJcmFZcUJZak8jCwpiXmFKfyQmluBgU31xBnD93S4gKgNFBDfHpRIogyMDMzsTAyNDYmQgkA6uQxIw</recordid><startdate>20031118</startdate><enddate>20031118</enddate><creator>Patterson, Timothy</creator><creator>Hock, Alex Lim Tiang</creator><scope>EFH</scope></search><sort><creationdate>20031118</creationdate><title>Manufacturing method for attaching components to a substrate</title><author>Patterson, Timothy ; Hock, Alex Lim Tiang</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_066482133</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Patterson, Timothy</creatorcontrib><creatorcontrib>Hock, Alex Lim Tiang</creatorcontrib><creatorcontrib>Saturn Electronics & Engineering, Inc</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Patterson, Timothy</au><au>Hock, Alex Lim Tiang</au><aucorp>Saturn Electronics & Engineering, Inc</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Manufacturing method for attaching components to a substrate</title><date>2003-11-18</date><risdate>2003</risdate><abstract>The invention is directed to a chip assembly process, and more particularly to a process for connecting components to a substrate using solder balls and an underfill compound.
A method for manufacturing a chip assembly includes the steps of applying a controlled amount of flux to a plurality of solder balls on a die, applying a non-fluxing underfill material to a substrate, and assembling the die and substrate together to form the chip assembly such that the non-fluxing underfill material is trapped in between the die and the substrate. By applying the underfill material to the substrate before the chip is assembled rather than afterward, the inventive method increases chip assembly speed while maintaining control over flux application to prevent the solder balls from collapsing, eliminate the need for a defined solder resist window, and maintain a consistent die-to-substrate clearance at the solder joint.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_uspatents_grants_06648213 |
source | USPTO Issued Patents |
title | Manufacturing method for attaching components to a substrate |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-24T03%3A47%3A52IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Patterson,%20Timothy&rft.aucorp=Saturn%20Electronics%20&%20Engineering,%20Inc&rft.date=2003-11-18&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E06648213%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |