Stress relief bend useful in an integrated circuit redistribution patch

The invention relates to a metallic or an electrical lead terminus with a stress relief portion. A metallic or an electrical trace having a terminus and a stress relief bend formed in the trace adjacent the terminus. The electrical trace may have a portion carried by a flexible substrate to form a f...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Schreiber, Chris M, Le, Bao, Jensen, Eric Dean
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
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