Compositions for insulator and metal CMP and methods relating thereto

Compositions for insulator and metal CMP and methods relating thereto

1. Field of the invention A composition is provided which is useful for the polishing of a semiconductor wafer substrate comprising an organic polymer having a backbone comprised of at least 16 carbon atoms, the polymer having a plurality of moieties with affinity to surface groups on the semiconduc...

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Hauptverfasser: Costas, Wesley D, Shen, James, Mandigo, Glenn C, Thomas, Terence M, Lack, Craig D, Barker, II, Ross E
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Sprache:eng
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creator Costas, Wesley D
Shen, James
Mandigo, Glenn C
Thomas, Terence M
Lack, Craig D
Barker, II, Ross E
description 1. Field of the invention A composition is provided which is useful for the polishing of a semiconductor wafer substrate comprising an organic polymer having a backbone comprised of at least 16 carbon atoms, the polymer having a plurality of moieties with affinity to surface groups on the semiconductor wafer surface.Another composition is provided which is useful for the polishing of a semiconductor wafer substrate comprising a surfactant having a carbon chain backbone comprised of at least 16 carbon atoms.
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Field of the invention A composition is provided which is useful for the polishing of a semiconductor wafer substrate comprising an organic polymer having a backbone comprised of at least 16 carbon atoms, the polymer having a plurality of moieties with affinity to surface groups on the semiconductor wafer surface.Another composition is provided which is useful for the polishing of a semiconductor wafer substrate comprising a surfactant having a carbon chain backbone comprised of at least 16 carbon atoms.</abstract><oa>free_for_read</oa></addata></record>
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title Compositions for insulator and metal CMP and methods relating thereto
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