Method for specifying, identifying, selecting or verifying differential signal pairs on IC packages

Method for specifying, identifying, selecting or verifying differential signal pairs on IC packages

1. Field of the Invention An automated method of selecting differential pairs in an integrated circuit comprising loading the design database for the integrated circuit package, and selecting output parameters for the differential pairs comprises adjacency criteria for the different pairs, time of f...

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Hauptverfasser: Buffet, Patrick H, Lussier, Craig, Natonio, Joseph
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Sprache:eng
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creator Buffet, Patrick H
Lussier, Craig
Natonio, Joseph
description 1. Field of the Invention An automated method of selecting differential pairs in an integrated circuit comprising loading the design database for the integrated circuit package, and selecting output parameters for the differential pairs comprises adjacency criteria for the different pairs, time of flight tolerances for the differential pairs, and the redistribution layers and their voltage references. The method then includes comparing the output parameters to the design in the design database, and obtaining a resulting differential pairs list. The differential pair list preferably includes differential signal pairs having electrical characteristics within a predetermined design tolerance range. At least some of the differential signal pairs may comprise individual wires or connectors not physically adjacent one another.
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Field of the Invention An automated method of selecting differential pairs in an integrated circuit comprising loading the design database for the integrated circuit package, and selecting output parameters for the differential pairs comprises adjacency criteria for the different pairs, time of flight tolerances for the differential pairs, and the redistribution layers and their voltage references. The method then includes comparing the output parameters to the design in the design database, and obtaining a resulting differential pairs list. The differential pair list preferably includes differential signal pairs having electrical characteristics within a predetermined design tolerance range. 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Field of the Invention An automated method of selecting differential pairs in an integrated circuit comprising loading the design database for the integrated circuit package, and selecting output parameters for the differential pairs comprises adjacency criteria for the different pairs, time of flight tolerances for the differential pairs, and the redistribution layers and their voltage references. The method then includes comparing the output parameters to the design in the design database, and obtaining a resulting differential pairs list. The differential pair list preferably includes differential signal pairs having electrical characteristics within a predetermined design tolerance range. 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Field of the Invention An automated method of selecting differential pairs in an integrated circuit comprising loading the design database for the integrated circuit package, and selecting output parameters for the differential pairs comprises adjacency criteria for the different pairs, time of flight tolerances for the differential pairs, and the redistribution layers and their voltage references. The method then includes comparing the output parameters to the design in the design database, and obtaining a resulting differential pairs list. The differential pair list preferably includes differential signal pairs having electrical characteristics within a predetermined design tolerance range. At least some of the differential signal pairs may comprise individual wires or connectors not physically adjacent one another.</abstract><oa>free_for_read</oa></addata></record>
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title Method for specifying, identifying, selecting or verifying differential signal pairs on IC packages
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