Ball grid array package

The present invention relates to ball grid array packages. The present invention provides a glass BGA (ball grid array) including a glass substrate having a plurality of conductive leads, such as thin film metal deposited thereon. A die or chip is mounted in a fixed relationship to the glass substrate, and is often mounted on the glass substrate. The die includes a plurality of I/O pads for providing electrical access to circuitry inside the die. Circuitry is included for connecting the plurality of I/O pads to the plurality of conductive leads on the glass substrate.