Electrical control methods involving semiconductor components

1. Field of the Invention A monolithic assembly includes vertical power semiconductor components formed throughout the thickness of a low doped semiconductive wafer of a first conductivity type, whose bottom surface is uniformly coated with a metallization. At least some of these components, so-call...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Pezzani, Robert
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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