Wire bonding method and wire bonding apparatus
1. Field of the Invention A wire bonding apparatus includes a bonding tool having a pressing surface for pressing a wire onto a surface to be joined to the wire and a wire feeding hole open to the pressing surface; a wire feeder for feeding the wire outside of the bonding tool through the wire feedi...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!