Apparatus and methods of semiconductor packages having circuit-bearing interconnect components

The present invention relates to apparatus and methods of testing and assembling semiconductor packages, and more specifically, to testing and assembling fine ball grid array (FBGA) packages having circuit-bearing interconnect components. Apparatus and methods of testing and assembling fine ball grid array (FBGA) packages having circuit-bearing interconnect components. In one embodiment, a circuit-bearing interconnect component includes a substrate having a plurality of first conductive members disposed therethrough, a plurality of conductive traces coupled to the first conductive members and extending away from the first conductive members to a distal portion of the substrate, and a plurality of second conductive members disposed on the distal portion and coupled to the conductive traces. The substrate may be rigid or flexible. The first conducting members are located within an engagement area that is adapted to be engageable with a semiconductor component having a plurality of conductive bumps wherein each conductive bump engages one of the first conductive members. The first conductive members may include conductively-plated via or conductive pins. In an alternate embodiment, an apparatus further includes a semiconductor component having a plurality of conductive bumps disposed thereon. The circuit-bearing interconnect component may permit efficient, accurate, and reliable testing of the semiconductor component when the semiconductor component is attached to a semiconductor device, such as a printed circuit board.