Ball grid array substrate with improved traces formed from copper based metal

The present invention relates to ball grid array substrates having traces formed from a copper-based metal. In one aspect, it relates to micro ball grid array integrated circuit packages. A micro-BGA style package for semiconductor device comprises a semiconductor chip and a package substrate. The s...

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Bibliographische Detailangaben

Hauptverfasser:	Perez, Paul Gabriel D, Mandapat, Ma Celine R, Arabe, Ferdinand B, Soria, Alvin O
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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