High thermal conductivity lossy dielectric using a multi layer configuration
1. Field of the Invention Systems and methods are described for loss dielectrics. A loss dielectric includes at least one high dielectric loss layer and at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer. A method of manufacturin...
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| creator | Tiegs, Terry N Kiggans, Jr., James O |
| description | 1. Field of the Invention
Systems and methods are described for loss dielectrics. A loss dielectric includes at least one high dielectric loss layer and at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer. A method of manufacturing a loss dielectric includes providing at least one high dielectric loss layer and providing at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer. The systems and methods provide advantages because the loss dielectrics are less costly and more environmentally friendly than the available alternatives. |
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Systems and methods are described for loss dielectrics. A loss dielectric includes at least one high dielectric loss layer and at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer. A method of manufacturing a loss dielectric includes providing at least one high dielectric loss layer and providing at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer. The systems and methods provide advantages because the loss dielectrics are less costly and more environmentally friendly than the available alternatives.</description><language>eng</language><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6509808$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,798,881,64012</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6509808$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Tiegs, Terry N</creatorcontrib><creatorcontrib>Kiggans, Jr., James O</creatorcontrib><creatorcontrib>Lockhead Martin Energy Research</creatorcontrib><title>High thermal conductivity lossy dielectric using a multi layer configuration</title><description>1. Field of the Invention
Systems and methods are described for loss dielectrics. A loss dielectric includes at least one high dielectric loss layer and at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer. A method of manufacturing a loss dielectric includes providing at least one high dielectric loss layer and providing at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer. The systems and methods provide advantages because the loss dielectrics are less costly and more environmentally friendly than the available alternatives.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNqNy7EKwjAQgOEsDqK-w72AEBClzlLp4OguR3pND66J5C5C3l4KPoDTt_z_1j0GjjPYTGVBgZDTWIPxh62BZNUGI5NQsMIBqnKKgLBUMQbBRmU9Jo61oHFOe7eZUJQOP3cO7v3zNhyrvtEomb5iwRV_Oftr57vTH8kXri83dA</recordid><startdate>20030121</startdate><enddate>20030121</enddate><creator>Tiegs, Terry N</creator><creator>Kiggans, Jr., James O</creator><scope>EFH</scope></search><sort><creationdate>20030121</creationdate><title>High thermal conductivity lossy dielectric using a multi layer configuration</title><author>Tiegs, Terry N ; Kiggans, Jr., James O</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_065098083</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Tiegs, Terry N</creatorcontrib><creatorcontrib>Kiggans, Jr., James O</creatorcontrib><creatorcontrib>Lockhead Martin Energy Research</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Tiegs, Terry N</au><au>Kiggans, Jr., James O</au><aucorp>Lockhead Martin Energy Research</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>High thermal conductivity lossy dielectric using a multi layer configuration</title><date>2003-01-21</date><risdate>2003</risdate><abstract>1. Field of the Invention
Systems and methods are described for loss dielectrics. A loss dielectric includes at least one high dielectric loss layer and at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer. A method of manufacturing a loss dielectric includes providing at least one high dielectric loss layer and providing at least one high thermal conductivity-electrically insulating layer adjacent the at least one high dielectric loss layer. The systems and methods provide advantages because the loss dielectrics are less costly and more environmentally friendly than the available alternatives.</abstract><oa>free_for_read</oa></addata></record> |
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| title | High thermal conductivity lossy dielectric using a multi layer configuration |
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