Flip chip package with improved cap design and process for making thereof

1. Field of the Invention Wire bond packages which mount encapsulated semiconductor chips, such as plastic ball grid array (PBGA) packages providing for the mounting of so-called flip-chips. The chips are overlaid with heat spreading perforated cap wherein the perforations are filled with an adhesiv...

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Bibliographische Detailangaben

Hauptverfasser:	Farquhar, Donald S, Houser, David E, Papathomas, Konstantinos I
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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