Method of chemical mechanical polishing

This invention relates generally to the field of chemical mechanical polishing (CMP) of semiconductor wafers or substrates. More specifically, the invention relates to a method of chemical mechanical polishing of semiconductor wafers or substrates. In the Chemical Mechanical Polishing (CMP) process...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Saka, Nannaji, Lai, Jiun-Yu, Oh, Hilario L
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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