Cladded material construction for etched-tri-metal circuits
1. Field of the Invention A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to...
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creator | Achari, Achyuta Nation, Brenda Joyce Baker, Jay D Goenka, Lakhi Nandlal Paruchuri, Mohan R Stoica, Vladimir |
description | 1. Field of the Invention
A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer on the outside surface of the tri-metal material. Alternatively bonding materials may be used on the intermediate surfaces; such bonding materials can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc. |
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A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer on the outside surface of the tri-metal material. Alternatively bonding materials may be used on the intermediate surfaces; such bonding materials can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc.</description><language>eng</language><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6454878$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,777,799,882,64018</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6454878$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Achari, Achyuta</creatorcontrib><creatorcontrib>Nation, Brenda Joyce</creatorcontrib><creatorcontrib>Baker, Jay D</creatorcontrib><creatorcontrib>Goenka, Lakhi Nandlal</creatorcontrib><creatorcontrib>Paruchuri, Mohan R</creatorcontrib><creatorcontrib>Stoica, Vladimir</creatorcontrib><creatorcontrib>Visteon Global Technologies, Inc</creatorcontrib><title>Cladded material construction for etched-tri-metal circuits</title><description>1. Field of the Invention
A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer on the outside surface of the tri-metal material. Alternatively bonding materials may be used on the intermediate surfaces; such bonding materials can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZLB2zklMSUlNUchNLEktykzMUUjOzysuKSpNLsnMz1NIyy9SSC1JzkhN0S0pytTNTS0BqcgsSi7NLCnmYWBNS8wpTuWF0twMCm6uIc4euqXFBUDT8kqK49OLEkGUgZmJqYmFuYUxEUoAnSgwtQ</recordid><startdate>20020924</startdate><enddate>20020924</enddate><creator>Achari, Achyuta</creator><creator>Nation, Brenda Joyce</creator><creator>Baker, Jay D</creator><creator>Goenka, Lakhi Nandlal</creator><creator>Paruchuri, Mohan R</creator><creator>Stoica, Vladimir</creator><scope>EFH</scope></search><sort><creationdate>20020924</creationdate><title>Cladded material construction for etched-tri-metal circuits</title><author>Achari, Achyuta ; Nation, Brenda Joyce ; Baker, Jay D ; Goenka, Lakhi Nandlal ; Paruchuri, Mohan R ; Stoica, Vladimir</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_064548783</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Achari, Achyuta</creatorcontrib><creatorcontrib>Nation, Brenda Joyce</creatorcontrib><creatorcontrib>Baker, Jay D</creatorcontrib><creatorcontrib>Goenka, Lakhi Nandlal</creatorcontrib><creatorcontrib>Paruchuri, Mohan R</creatorcontrib><creatorcontrib>Stoica, Vladimir</creatorcontrib><creatorcontrib>Visteon Global Technologies, Inc</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Achari, Achyuta</au><au>Nation, Brenda Joyce</au><au>Baker, Jay D</au><au>Goenka, Lakhi Nandlal</au><au>Paruchuri, Mohan R</au><au>Stoica, Vladimir</au><aucorp>Visteon Global Technologies, Inc</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Cladded material construction for etched-tri-metal circuits</title><date>2002-09-24</date><risdate>2002</risdate><abstract>1. Field of the Invention
A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer on the outside surface of the tri-metal material. Alternatively bonding materials may be used on the intermediate surfaces; such bonding materials can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc.</abstract><oa>free_for_read</oa></addata></record> |
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title | Cladded material construction for etched-tri-metal circuits |
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