Stabilization of fluorine-containing low-k dielectrics in a metal/insulator wiring structure by ultraviolet irradiation

The present invention relates to metal/insulator interconnect structures found in Very Large Scale Integrated (VLSI) and Ultra Large Scale Integrated (ULSI) devices and packaging, and more particularly to interconnect structures comprising fluorine-containing, low dielectric constant (low-k) dielect...

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Bibliographische Detailangaben

Hauptverfasser:	Babich, Katherina, Callegari, Alessandro, Cohen, Stephen Alan, Grill, Alfred, Jahnes, Christopher Vincent, Patel, Vishnubhai Vitthalbhai, Purushothaman, Sampath, Saenger, Katherine Lynn
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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