Method of making a semiconductor device having a dual damascene interconnect spaced from a support structure

The present invention relates to semiconductor devices that include dual damascene interconnects and methods for making them. A semiconductor device and an improved method for making it are described. The semiconductor device comprises a dual damascene interconnect that includes a conductive line. T...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Morrow, Patrick, Morrow, Xiaorong
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!