Electronic package and method of making same
This invention relates to an electronic package for use in packaging semiconductors, and more particularly to such packages wherein an electronic device (e.g. semiconductor chip) is located on a substrate and coupled thereto. An electronic package and method of making the electronic package is provi...
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| creator | Bhatt, Ashwinkumar C Logan, Paul E Rai, Amarjit S |
| description | This invention relates to an electronic package for use in packaging semiconductors, and more particularly to such packages wherein an electronic device (e.g. semiconductor chip) is located on a substrate and coupled thereto.
An electronic package and method of making the electronic package is provided. An opening in the substrate of the electronic package is formed to substantially prevent adhesive which can bleed from under an electronic device from contacting conductive pads on the substrate. An electrical coupling is formed between the package's electronic device and conductive pads. |
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An electronic package and method of making the electronic package is provided. An opening in the substrate of the electronic package is formed to substantially prevent adhesive which can bleed from under an electronic device from contacting conductive pads on the substrate. An electrical coupling is formed between the package's electronic device and conductive pads.</description><language>eng</language><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6426565$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,309,781,803,886,64041</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6426565$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Bhatt, Ashwinkumar C</creatorcontrib><creatorcontrib>Logan, Paul E</creatorcontrib><creatorcontrib>Rai, Amarjit S</creatorcontrib><creatorcontrib>International Business Machines Corporation</creatorcontrib><title>Electronic package and method of making same</title><description>This invention relates to an electronic package for use in packaging semiconductors, and more particularly to such packages wherein an electronic device (e.g. semiconductor chip) is located on a substrate and coupled thereto.
An electronic package and method of making the electronic package is provided. An opening in the substrate of the electronic package is formed to substantially prevent adhesive which can bleed from under an electronic device from contacting conductive pads on the substrate. An electrical coupling is formed between the package's electronic device and conductive pads.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZNBxzUlNLinKz8tMVihITM5OTE9VSMxLUchNLcnIT1HIT1PITczOzEtXKE7MTeVhYE1LzClO5YXS3AwKbq4hzh66pcUFiSWpeSXF8elFiSDKwMzEyMzUzNSYCCUAP-IqPw</recordid><startdate>20020730</startdate><enddate>20020730</enddate><creator>Bhatt, Ashwinkumar C</creator><creator>Logan, Paul E</creator><creator>Rai, Amarjit S</creator><scope>EFH</scope></search><sort><creationdate>20020730</creationdate><title>Electronic package and method of making same</title><author>Bhatt, Ashwinkumar C ; Logan, Paul E ; Rai, Amarjit S</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_064265653</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Bhatt, Ashwinkumar C</creatorcontrib><creatorcontrib>Logan, Paul E</creatorcontrib><creatorcontrib>Rai, Amarjit S</creatorcontrib><creatorcontrib>International Business Machines Corporation</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Bhatt, Ashwinkumar C</au><au>Logan, Paul E</au><au>Rai, Amarjit S</au><aucorp>International Business Machines Corporation</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Electronic package and method of making same</title><date>2002-07-30</date><risdate>2002</risdate><abstract>This invention relates to an electronic package for use in packaging semiconductors, and more particularly to such packages wherein an electronic device (e.g. semiconductor chip) is located on a substrate and coupled thereto.
An electronic package and method of making the electronic package is provided. An opening in the substrate of the electronic package is formed to substantially prevent adhesive which can bleed from under an electronic device from contacting conductive pads on the substrate. An electrical coupling is formed between the package's electronic device and conductive pads.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| source | USPTO Issued Patents |
| title | Electronic package and method of making same |
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