Method of forming seals for a microfluidic device
The present invention relates to microfluidic devices, and more particularly, to the sealing layers between with a device and a method of forming seals on a microfluidic device. A microfluidic device has a seal or other component between two adjacent layers. The seal or other component is formed of...
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| creator | O'Mara, Kerry Dennis |
| description | The present invention relates to microfluidic devices, and more particularly, to the sealing layers between with a device and a method of forming seals on a microfluidic device.
A microfluidic device has a seal or other component between two adjacent layers. The seal or other component is formed of a sheet of material having a first thickness. The seal material has boss portions that have a second thickness greater than the first thickness. A plurality of holes are formed through the boss portion. A method for making the seal layer includes the step of thinning the seal material between a first film and a second film. Bosses are formed in the film. Holes are cut through the boss area. One film is removed from the seal material and the seal material is applied to a substrate. The seal material is cured to a substrate and the second film is removed from the seal material. Other components such as diaphragm may be formed using the above process without punching holes through the seal material. |
| format | Patent |
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A microfluidic device has a seal or other component between two adjacent layers. The seal or other component is formed of a sheet of material having a first thickness. The seal material has boss portions that have a second thickness greater than the first thickness. A plurality of holes are formed through the boss portion. A method for making the seal layer includes the step of thinning the seal material between a first film and a second film. Bosses are formed in the film. Holes are cut through the boss area. One film is removed from the seal material and the seal material is applied to a substrate. The seal material is cured to a substrate and the second film is removed from the seal material. Other components such as diaphragm may be formed using the above process without punching holes through the seal material.</description><language>eng</language><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6423273$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,777,799,882,64018</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6423273$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>O'Mara, Kerry Dennis</creatorcontrib><creatorcontrib>Orchid BioSciences, Inc</creatorcontrib><title>Method of forming seals for a microfluidic device</title><description>The present invention relates to microfluidic devices, and more particularly, to the sealing layers between with a device and a method of forming seals on a microfluidic device.
A microfluidic device has a seal or other component between two adjacent layers. The seal or other component is formed of a sheet of material having a first thickness. The seal material has boss portions that have a second thickness greater than the first thickness. A plurality of holes are formed through the boss portion. A method for making the seal layer includes the step of thinning the seal material between a first film and a second film. Bosses are formed in the film. Holes are cut through the boss area. One film is removed from the seal material and the seal material is applied to a substrate. The seal material is cured to a substrate and the second film is removed from the seal material. Other components such as diaphragm may be formed using the above process without punching holes through the seal material.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZDD0TS3JyE9RyE9TSMsvys3MS1coTk3MKQbxFBIVcjOTi_LTckozUzKTFVJSyzKTU3kYWNOAClJ5oTQ3g4Kba4izh25pcUFiSWpeSXF8elEiiDIwMzEyNjI3NiZCCQA9Ziwu</recordid><startdate>20020723</startdate><enddate>20020723</enddate><creator>O'Mara, Kerry Dennis</creator><scope>EFH</scope></search><sort><creationdate>20020723</creationdate><title>Method of forming seals for a microfluidic device</title><author>O'Mara, Kerry Dennis</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_064232733</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><toplevel>online_resources</toplevel><creatorcontrib>O'Mara, Kerry Dennis</creatorcontrib><creatorcontrib>Orchid BioSciences, Inc</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>O'Mara, Kerry Dennis</au><aucorp>Orchid BioSciences, Inc</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Method of forming seals for a microfluidic device</title><date>2002-07-23</date><risdate>2002</risdate><abstract>The present invention relates to microfluidic devices, and more particularly, to the sealing layers between with a device and a method of forming seals on a microfluidic device.
A microfluidic device has a seal or other component between two adjacent layers. The seal or other component is formed of a sheet of material having a first thickness. The seal material has boss portions that have a second thickness greater than the first thickness. A plurality of holes are formed through the boss portion. A method for making the seal layer includes the step of thinning the seal material between a first film and a second film. Bosses are formed in the film. Holes are cut through the boss area. One film is removed from the seal material and the seal material is applied to a substrate. The seal material is cured to a substrate and the second film is removed from the seal material. Other components such as diaphragm may be formed using the above process without punching holes through the seal material.</abstract><oa>free_for_read</oa></addata></record> |
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| title | Method of forming seals for a microfluidic device |
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