Apparatus for cutting wafer sandwiches

The present invention relates to an apparatus for cutting wafer sandwiches or stacks of wafer sandwiches. More particularly this invention concerns such an apparatus which longitudinally and transversely cuts a wafer sandwich into a plurality of small rectangular pieces. An apparatus for cutting a wafer sandwich into a plurality of rectangular pieces has a support surface defining a transport path extending longitudinally through a longitudinal-cutting station and a transverse-cutting station. A plurality of stationary and transversely spaced longitudinal blades extend across the path in the longitudinal-cutting station. The surface is formed in the transverse-cutting station with a plurality of transversely extending and longitudinally spaced slots. An abutment is displaceable immediately downstream of the transverse-cutting station between a blocking position in the path and a retracted position clear of the path. A plurality of transverse blades are displaceable transversely in the slots of the transverse-cutting station across the path. A conveyor above the surface has pusher elements engageable with the wafer sandwich for pushing it longitudinally in a transport direction along the path through the longitudinal-cutting station, into the transverse-cutting station and against the abutment in the blocking position thereof, and out of the transverse-cutting station in the retracted position of the abutment.