Method for manufacturing printed circuit board

1. Field of the Invention A method for manufacturing a printed circuit board is disclosed. When a metal is plated on an upper board to form a circuit, bonding fingers for being bonded with a semiconductor chip are prevented from being electroplated with a metal. That is, a slot with an ink layer formed therein is formed in each of a plurality of boards. Then window regions of different sizes are defined, and a working is carried out on the portion where the slots are not formed. That is, the copper clad laminates are subjected to a working to form slots, and an ink layer is formed within each of the slots. In this manner, during the plating of the upper face of the printed circuit board, the metal is prevented from intruding into the window region, thereby preventing the formation of a short circuit.