Semiconductor package and method for forming same

The present invention relates in general to a semiconductor package and a method of forming the semiconductor package, and more particularly to a semiconductor package and method of forming the semiconductor package using a removable carrier. A semiconductor package () with a die () having die pads () coupled to inner ends () of interconnects (), the die () and the interconnects () are molded in mold compound () with mounting surface () and outer ends () exposed. A semiconductor die has an interconnect surface opposite the mounting surface.