Probe for testing and repairing printed circuit features
1. Field of the Invention A handheld probe for testing and monitoring features and pads on circuit boards and other electrical components is provided. The handheld probe includes a probe base having a probe connected to any type of meter, instrument or display and the like. The probe is positioned a...
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creator | Majka, Christopher J Seward, Matthew |
description | 1. Field of the Invention
A handheld probe for testing and monitoring features and pads on circuit boards and other electrical components is provided. The handheld probe includes a probe base having a probe connected to any type of meter, instrument or display and the like. The probe is positioned at an angle away from the probe base and is held in its angled position with respect to the probe base by a probe holder and a probe clamp. Upper and lower cantilever springs are positioned within a hollowed portion of the probe base, and provide a spring return of the probe when a push button is released from its depressed position. A spacer is provided between the upper and lower cantilever springs. |
format | Patent |
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A handheld probe for testing and monitoring features and pads on circuit boards and other electrical components is provided. The handheld probe includes a probe base having a probe connected to any type of meter, instrument or display and the like. The probe is positioned at an angle away from the probe base and is held in its angled position with respect to the probe base by a probe holder and a probe clamp. Upper and lower cantilever springs are positioned within a hollowed portion of the probe base, and provide a spring return of the probe when a push button is released from its depressed position. A spacer is provided between the upper and lower cantilever springs.</description><language>eng</language><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6369592$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,802,885,64039</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6369592$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Majka, Christopher J</creatorcontrib><creatorcontrib>Seward, Matthew</creatorcontrib><creatorcontrib>International Business Machines Corporation</creatorcontrib><title>Probe for testing and repairing printed circuit features</title><description>1. Field of the Invention
A handheld probe for testing and monitoring features and pads on circuit boards and other electrical components is provided. The handheld probe includes a probe base having a probe connected to any type of meter, instrument or display and the like. The probe is positioned at an angle away from the probe base and is held in its angled position with respect to the probe base by a probe holder and a probe clamp. Upper and lower cantilever springs are positioned within a hollowed portion of the probe base, and provide a spring return of the probe when a push button is released from its depressed position. A spacer is provided between the upper and lower cantilever springs.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNrjZLAIKMpPSlVIyy9SKEktLsnMS1dIzEtRKEotSMwsAvEKgGRJaopCcmZRcmlmiUJaamJJaVFqMQ8Da1piTnEqL5TmZlBwcw1x9tAtLS5ILEnNKymOTy9KBFEGZsZmlqaWRsZEKAEA6Dwvdg</recordid><startdate>20020409</startdate><enddate>20020409</enddate><creator>Majka, Christopher J</creator><creator>Seward, Matthew</creator><scope>EFH</scope></search><sort><creationdate>20020409</creationdate><title>Probe for testing and repairing printed circuit features</title><author>Majka, Christopher J ; Seward, Matthew</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_063695923</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Majka, Christopher J</creatorcontrib><creatorcontrib>Seward, Matthew</creatorcontrib><creatorcontrib>International Business Machines Corporation</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Majka, Christopher J</au><au>Seward, Matthew</au><aucorp>International Business Machines Corporation</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Probe for testing and repairing printed circuit features</title><date>2002-04-09</date><risdate>2002</risdate><abstract>1. Field of the Invention
A handheld probe for testing and monitoring features and pads on circuit boards and other electrical components is provided. The handheld probe includes a probe base having a probe connected to any type of meter, instrument or display and the like. The probe is positioned at an angle away from the probe base and is held in its angled position with respect to the probe base by a probe holder and a probe clamp. Upper and lower cantilever springs are positioned within a hollowed portion of the probe base, and provide a spring return of the probe when a push button is released from its depressed position. A spacer is provided between the upper and lower cantilever springs.</abstract><oa>free_for_read</oa></addata></record> |
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title | Probe for testing and repairing printed circuit features |
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