Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias

The present invention generally relates to copper-filled vias in ceramic substrates and, more particularly, to a copper-based paste containing copper aluminate powder in proper particle size and weight proportion for grain size and shrinkage control of the via and thick film copper produced by sinte...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Aoude, Farid Youssif, David, Lawrence Daniel, Divakaruni, Renuka Shastri, Farooq, Shaji, Herron, Lester Wynn, Lasky, Hal Mitchell, Mastreani, Anthony, Natarajan, Govindarajan, Reddy, Srinivasa S. N, Sura, Vivek Madan, Vallabhaneni, Rao Venkateswara, Wall, Donald Rene
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!