Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias

Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias

The present invention generally relates to copper-filled vias in ceramic substrates and, more particularly, to a copper-based paste containing copper aluminate powder in proper particle size and weight proportion for grain size and shrinkage control of the via and thick film copper produced by sinte...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Aoude, Farid Youssif, David, Lawrence Daniel, Divakaruni, Renuka Shastri, Farooq, Shaji, Herron, Lester Wynn, Lasky, Hal Mitchell, Mastreani, Anthony, Natarajan, Govindarajan, Reddy, Srinivasa S. N, Sura, Vivek Madan, Vallabhaneni, Rao Venkateswara, Wall, Donald Rene
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Aoude, Farid Youssif
David, Lawrence Daniel
Divakaruni, Renuka Shastri
Farooq, Shaji
Herron, Lester Wynn
Lasky, Hal Mitchell
Mastreani, Anthony
Natarajan, Govindarajan
Reddy, Srinivasa S. N
Sura, Vivek Madan
Vallabhaneni, Rao Venkateswara
Wall, Donald Rene
description The present invention generally relates to copper-filled vias in ceramic substrates and, more particularly, to a copper-based paste containing copper aluminate powder in proper particle size and weight proportion for grain size and shrinkage control of the via and thick film copper produced by sintering. A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.
format Patent
fullrecord <record><control><sourceid>uspatents_EFH</sourceid><recordid>TN_cdi_uspatents_grants_06358439</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>06358439</sourcerecordid><originalsourceid>FETCH-uspatents_grants_063584393</originalsourceid><addsrcrecordid>eNqNjEEKwjAQRbtxIeod5gIFoSq6LhUP4F7GNImD6STMJJ7fFHsAV__D---vG-5jSlbaJ6odIaFmCyZyRmJiX-tMAUOZiLEyFwUmMhI1SzG5CAZAHkFfQvxG_7MlBohusVtHIdTzD6Fum5XDoHa35KaB63Dvb23RVO8568MLzrE_dcfzobt0f0y-0-pETA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias</title><source>USPTO Issued Patents</source><creator>Aoude, Farid Youssif ; David, Lawrence Daniel ; Divakaruni, Renuka Shastri ; Farooq, Shaji ; Herron, Lester Wynn ; Lasky, Hal Mitchell ; Mastreani, Anthony ; Natarajan, Govindarajan ; Reddy, Srinivasa S. N ; Sura, Vivek Madan ; Vallabhaneni, Rao Venkateswara ; Wall, Donald Rene</creator><creatorcontrib>Aoude, Farid Youssif ; David, Lawrence Daniel ; Divakaruni, Renuka Shastri ; Farooq, Shaji ; Herron, Lester Wynn ; Lasky, Hal Mitchell ; Mastreani, Anthony ; Natarajan, Govindarajan ; Reddy, Srinivasa S. N ; Sura, Vivek Madan ; Vallabhaneni, Rao Venkateswara ; Wall, Donald Rene ; International Business Machines Corporation</creatorcontrib><description>The present invention generally relates to copper-filled vias in ceramic substrates and, more particularly, to a copper-based paste containing copper aluminate powder in proper particle size and weight proportion for grain size and shrinkage control of the via and thick film copper produced by sintering. A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.</description><language>eng</language><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6358439$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,802,885,64039</link.rule.ids><linktorsrc>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/6358439$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Aoude, Farid Youssif</creatorcontrib><creatorcontrib>David, Lawrence Daniel</creatorcontrib><creatorcontrib>Divakaruni, Renuka Shastri</creatorcontrib><creatorcontrib>Farooq, Shaji</creatorcontrib><creatorcontrib>Herron, Lester Wynn</creatorcontrib><creatorcontrib>Lasky, Hal Mitchell</creatorcontrib><creatorcontrib>Mastreani, Anthony</creatorcontrib><creatorcontrib>Natarajan, Govindarajan</creatorcontrib><creatorcontrib>Reddy, Srinivasa S. N</creatorcontrib><creatorcontrib>Sura, Vivek Madan</creatorcontrib><creatorcontrib>Vallabhaneni, Rao Venkateswara</creatorcontrib><creatorcontrib>Wall, Donald Rene</creatorcontrib><creatorcontrib>International Business Machines Corporation</creatorcontrib><title>Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias</title><description>The present invention generally relates to copper-filled vias in ceramic substrates and, more particularly, to a copper-based paste containing copper aluminate powder in proper particle size and weight proportion for grain size and shrinkage control of the via and thick film copper produced by sintering. A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EFH</sourceid><recordid>eNqNjEEKwjAQRbtxIeod5gIFoSq6LhUP4F7GNImD6STMJJ7fFHsAV__D---vG-5jSlbaJ6odIaFmCyZyRmJiX-tMAUOZiLEyFwUmMhI1SzG5CAZAHkFfQvxG_7MlBohusVtHIdTzD6Fum5XDoHa35KaB63Dvb23RVO8568MLzrE_dcfzobt0f0y-0-pETA</recordid><startdate>20020319</startdate><enddate>20020319</enddate><creator>Aoude, Farid Youssif</creator><creator>David, Lawrence Daniel</creator><creator>Divakaruni, Renuka Shastri</creator><creator>Farooq, Shaji</creator><creator>Herron, Lester Wynn</creator><creator>Lasky, Hal Mitchell</creator><creator>Mastreani, Anthony</creator><creator>Natarajan, Govindarajan</creator><creator>Reddy, Srinivasa S. N</creator><creator>Sura, Vivek Madan</creator><creator>Vallabhaneni, Rao Venkateswara</creator><creator>Wall, Donald Rene</creator><scope>EFH</scope></search><sort><creationdate>20020319</creationdate><title>Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias</title><author>Aoude, Farid Youssif ; David, Lawrence Daniel ; Divakaruni, Renuka Shastri ; Farooq, Shaji ; Herron, Lester Wynn ; Lasky, Hal Mitchell ; Mastreani, Anthony ; Natarajan, Govindarajan ; Reddy, Srinivasa S. N ; Sura, Vivek Madan ; Vallabhaneni, Rao Venkateswara ; Wall, Donald Rene</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_grants_063584393</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Aoude, Farid Youssif</creatorcontrib><creatorcontrib>David, Lawrence Daniel</creatorcontrib><creatorcontrib>Divakaruni, Renuka Shastri</creatorcontrib><creatorcontrib>Farooq, Shaji</creatorcontrib><creatorcontrib>Herron, Lester Wynn</creatorcontrib><creatorcontrib>Lasky, Hal Mitchell</creatorcontrib><creatorcontrib>Mastreani, Anthony</creatorcontrib><creatorcontrib>Natarajan, Govindarajan</creatorcontrib><creatorcontrib>Reddy, Srinivasa S. N</creatorcontrib><creatorcontrib>Sura, Vivek Madan</creatorcontrib><creatorcontrib>Vallabhaneni, Rao Venkateswara</creatorcontrib><creatorcontrib>Wall, Donald Rene</creatorcontrib><creatorcontrib>International Business Machines Corporation</creatorcontrib><collection>USPTO Issued Patents</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Aoude, Farid Youssif</au><au>David, Lawrence Daniel</au><au>Divakaruni, Renuka Shastri</au><au>Farooq, Shaji</au><au>Herron, Lester Wynn</au><au>Lasky, Hal Mitchell</au><au>Mastreani, Anthony</au><au>Natarajan, Govindarajan</au><au>Reddy, Srinivasa S. N</au><au>Sura, Vivek Madan</au><au>Vallabhaneni, Rao Venkateswara</au><au>Wall, Donald Rene</au><aucorp>International Business Machines Corporation</aucorp><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias</title><date>2002-03-19</date><risdate>2002</risdate><abstract>The present invention generally relates to copper-filled vias in ceramic substrates and, more particularly, to a copper-based paste containing copper aluminate powder in proper particle size and weight proportion for grain size and shrinkage control of the via and thick film copper produced by sintering. A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_uspatents_grants_06358439
source USPTO Issued Patents
title Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-06T06%3A40%3A35IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFH&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Aoude,%20Farid%20Youssif&rft.aucorp=International%20Business%20Machines%20Corporation&rft.date=2002-03-19&rft_id=info:doi/&rft_dat=%3Cuspatents_EFH%3E06358439%3C/uspatents_EFH%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true