Computerized method and apparatus for designing wire bond diagrams and locating bond pads for a semiconductor device

The present invention relates to the field of computerized integrated circuit design, in particular a computerized method and apparatus for designing bond diagrams and locating bond pads for a semiconductor device. The present invention provides a bond tool utility software package which extracts bo...

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Bibliographische Detailangaben

Hauptverfasser:	Eka, Laiman, Martinez, III, Marcello R, Fong, Carl H
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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