Metallic interlocking structure

1. Technical Field An electronic structure including a metallic interlocking structure for bonding a conductive plated layer to metal surface, and a method of forming the electronic structure. The method provides a substrate having a metallic sheet within a dielectric layer. The metallic sheet inclu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Advocate, Jr., Gerald G, Downes, Jr., Francis J, Matienzo, Luis J, Kaschak, Ronald A, Kresge, John S, Van Hart, Daniel C
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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