Electronic circuit package

Electronic circuit package

An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor bare chips include a processor for processing data and a circuit having a checking function for detecting...

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Hauptverfasser: Ihara, Hirokazu, Kanekawa, Nobuyasu, Akiyama, Masatsugu, Kawabata, Kiyoshi, Yamanaka, Hisayoshi, Okishima, Tetsuya
Format: Patent
Sprache:eng
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creator Ihara, Hirokazu
Kanekawa, Nobuyasu
Akiyama, Masatsugu
Kawabata, Kiyoshi
Yamanaka, Hisayoshi
Okishima, Tetsuya
description An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor bare chips include a processor for processing data and a circuit having a checking function for detecting faults of the processor.
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title Electronic circuit package
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