Photoimageable dielectric epoxy resin system film

Photoimageable dielectric epoxy resin system film

A method for fabricating circuitized substrates which reduces shorts, and does not require baking and resulting film. The method employs a photoimageable dielectric film, having a solvent content less than about 5%, and a glass transition temperature, when cured, which is greater than about 110° C....

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Hauptverfasser: Foster, Elizabeth, Johansson, Gary, Marcello, Heike, Russell, David
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Sprache:eng
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creator Foster, Elizabeth
Johansson, Gary
Marcello, Heike
Russell, David
description A method for fabricating circuitized substrates which reduces shorts, and does not require baking and resulting film. The method employs a photoimageable dielectric film, having a solvent content less than about 5%, and a glass transition temperature, when cured, which is greater than about 110° C. A photoimageable dielectric film is provided having from about 95% to about 100% solids, and comprising: from 0% to about 30% of the solids, of a particulate rheology modifier; from about 70% to about 100% of the solids of an epoxy resin system (liquid at 20° C.) comprising: from about 85% to about 99.9% epoxy resins; and from about 0.1 to 15 parts of the total resin weight, a cationic photoinitiator; from 0% to about 5% solvent; applying the photoimageable dielectric film to a circuitized substrate; and exposing the film to actinic radiation.
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fullrecord <record><control><sourceid>uspatents_EFI</sourceid><recordid>TN_cdi_uspatents_applications_20040161702</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>20040161702</sourcerecordid><originalsourceid>FETCH-uspatents_applications_200401617023</originalsourceid><addsrcrecordid>eNrjZDAMyMgvyc_MTUxPTUzKSVVIyUzNSU0uKcpMVkgtyK-oVChKLc7MUyiuLC5JzVVIy8zJ5WFgTUvMKU7lhdLcDJpuriHOHrqlxQWJJal5JcXxiQUFOZnJiSWZ-XnF8UYGBiYGhmaG5gZGxqSoBQAlqzMS</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Photoimageable dielectric epoxy resin system film</title><source>USPTO Published Applications</source><creator>Foster, Elizabeth ; Johansson, Gary ; Marcello, Heike ; Russell, David</creator><creatorcontrib>Foster, Elizabeth ; Johansson, Gary ; Marcello, Heike ; Russell, David</creatorcontrib><description>A method for fabricating circuitized substrates which reduces shorts, and does not require baking and resulting film. The method employs a photoimageable dielectric film, having a solvent content less than about 5%, and a glass transition temperature, when cured, which is greater than about 110° C. A photoimageable dielectric film is provided having from about 95% to about 100% solids, and comprising: from 0% to about 30% of the solids, of a particulate rheology modifier; from about 70% to about 100% of the solids of an epoxy resin system (liquid at 20° C.) comprising: from about 85% to about 99.9% epoxy resins; and from about 0.1 to 15 parts of the total resin weight, a cationic photoinitiator; from 0% to about 5% solvent; applying the photoimageable dielectric film to a circuitized substrate; and exposing the film to actinic radiation.</description><language>eng</language><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20040161702$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,873,885,64059</link.rule.ids><linktorsrc>$$Uhttps://patentcenter.uspto.gov/applications/10781073$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Foster, Elizabeth</creatorcontrib><creatorcontrib>Johansson, Gary</creatorcontrib><creatorcontrib>Marcello, Heike</creatorcontrib><creatorcontrib>Russell, David</creatorcontrib><title>Photoimageable dielectric epoxy resin system film</title><description>A method for fabricating circuitized substrates which reduces shorts, and does not require baking and resulting film. The method employs a photoimageable dielectric film, having a solvent content less than about 5%, and a glass transition temperature, when cured, which is greater than about 110° C. A photoimageable dielectric film is provided having from about 95% to about 100% solids, and comprising: from 0% to about 30% of the solids, of a particulate rheology modifier; from about 70% to about 100% of the solids of an epoxy resin system (liquid at 20° C.) comprising: from about 85% to about 99.9% epoxy resins; and from about 0.1 to 15 parts of the total resin weight, a cationic photoinitiator; from 0% to about 5% solvent; applying the photoimageable dielectric film to a circuitized substrate; and exposing the film to actinic radiation.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EFI</sourceid><recordid>eNrjZDAMyMgvyc_MTUxPTUzKSVVIyUzNSU0uKcpMVkgtyK-oVChKLc7MUyiuLC5JzVVIy8zJ5WFgTUvMKU7lhdLcDJpuriHOHrqlxQWJJal5JcXxiQUFOZnJiSWZ-XnF8UYGBiYGhmaG5gZGxqSoBQAlqzMS</recordid><startdate>20040819</startdate><enddate>20040819</enddate><creator>Foster, Elizabeth</creator><creator>Johansson, Gary</creator><creator>Marcello, Heike</creator><creator>Russell, David</creator><scope>EFI</scope></search><sort><creationdate>20040819</creationdate><title>Photoimageable dielectric epoxy resin system film</title><author>Foster, Elizabeth ; Johansson, Gary ; Marcello, Heike ; Russell, David</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_applications_200401617023</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2004</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Foster, Elizabeth</creatorcontrib><creatorcontrib>Johansson, Gary</creatorcontrib><creatorcontrib>Marcello, Heike</creatorcontrib><creatorcontrib>Russell, David</creatorcontrib><collection>USPTO Published Applications</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Foster, Elizabeth</au><au>Johansson, Gary</au><au>Marcello, Heike</au><au>Russell, David</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Photoimageable dielectric epoxy resin system film</title><date>2004-08-19</date><risdate>2004</risdate><abstract>A method for fabricating circuitized substrates which reduces shorts, and does not require baking and resulting film. The method employs a photoimageable dielectric film, having a solvent content less than about 5%, and a glass transition temperature, when cured, which is greater than about 110° C. A photoimageable dielectric film is provided having from about 95% to about 100% solids, and comprising: from 0% to about 30% of the solids, of a particulate rheology modifier; from about 70% to about 100% of the solids of an epoxy resin system (liquid at 20° C.) comprising: from about 85% to about 99.9% epoxy resins; and from about 0.1 to 15 parts of the total resin weight, a cationic photoinitiator; from 0% to about 5% solvent; applying the photoimageable dielectric film to a circuitized substrate; and exposing the film to actinic radiation.</abstract><oa>free_for_read</oa></addata></record>
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title Photoimageable dielectric epoxy resin system film
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-19T08%3A04%3A30IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFI&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Foster,%20Elizabeth&rft.date=2004-08-19&rft_id=info:doi/&rft_dat=%3Cuspatents_EFI%3E20040161702%3C/uspatents_EFI%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true