Halogen-free, phosphorus-free flame-retardant advanced epoxy resin and an epoxy composition containing the same

Halogen-free, phosphorus-free flame-retardant advanced epoxy resin and an epoxy composition containing the same

A halogen-free, phosphorus-free poly-cyclic compound is used a flame retardant. This compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin. The advanced epoxy resin together with an inorganic additive are...

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Hauptverfasser: Chiou, Kuo-Chan, Lee, Tzong-Ming, Tseng, Feng-Po, Liao, Lu-Shih, Huang, Jia-Chi, Lin, Tzu-Ting
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creator Chiou, Kuo-Chan
Lee, Tzong-Ming
Tseng, Feng-Po
Liao, Lu-Shih
Huang, Jia-Chi
Lin, Tzu-Ting
description A halogen-free, phosphorus-free poly-cyclic compound is used a flame retardant. This compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin. The advanced epoxy resin together with an inorganic additive are mixed with an epoxy resin to form a halogen-free, phosphorus-free flame-retardant epoxy composition, which can be used in the manufacture of a printed circuit board and as an encapsulation material for a semi-conductor device.
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fullrecord <record><control><sourceid>uspatents_EFI</sourceid><recordid>TN_cdi_uspatents_applications_20040110874</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>20040110874</sourcerecordid><originalsourceid>FETCH-uspatents_applications_200401108743</originalsourceid><addsrcrecordid>eNqVjEEKwjAQRbtxIeodZitYSLWge1F6APdlaKZtIJ0JmVT09kbpBVx8_ufxeetCGvQyEJd9JDpAGEVz4qw_AL3HicpICaNFToD2idyRBQryekMkdQzINmdBnUxB1CUnnDcndOx4gDQSaHZti1WPXmm39KbY32-Pa1POGjARJ20xBO86_Bq0PRpTm6oyl3N9-uf7AfrWSj4</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Halogen-free, phosphorus-free flame-retardant advanced epoxy resin and an epoxy composition containing the same</title><source>USPTO Published Applications</source><creator>Chiou, Kuo-Chan ; Lee, Tzong-Ming ; Tseng, Feng-Po ; Liao, Lu-Shih ; Huang, Jia-Chi ; Lin, Tzu-Ting</creator><creatorcontrib>Chiou, Kuo-Chan ; Lee, Tzong-Ming ; Tseng, Feng-Po ; Liao, Lu-Shih ; Huang, Jia-Chi ; Lin, Tzu-Ting</creatorcontrib><description>A halogen-free, phosphorus-free poly-cyclic compound is used a flame retardant. This compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin. The advanced epoxy resin together with an inorganic additive are mixed with an epoxy resin to form a halogen-free, phosphorus-free flame-retardant epoxy composition, which can be used in the manufacture of a printed circuit board and as an encapsulation material for a semi-conductor device.</description><language>eng</language><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20040110874$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,776,869,881,64032</link.rule.ids><linktorsrc>$$Uhttps://patentcenter.uspto.gov/applications/10384752$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Chiou, Kuo-Chan</creatorcontrib><creatorcontrib>Lee, Tzong-Ming</creatorcontrib><creatorcontrib>Tseng, Feng-Po</creatorcontrib><creatorcontrib>Liao, Lu-Shih</creatorcontrib><creatorcontrib>Huang, Jia-Chi</creatorcontrib><creatorcontrib>Lin, Tzu-Ting</creatorcontrib><title>Halogen-free, phosphorus-free flame-retardant advanced epoxy resin and an epoxy composition containing the same</title><description>A halogen-free, phosphorus-free poly-cyclic compound is used a flame retardant. This compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin. The advanced epoxy resin together with an inorganic additive are mixed with an epoxy resin to form a halogen-free, phosphorus-free flame-retardant epoxy composition, which can be used in the manufacture of a printed circuit board and as an encapsulation material for a semi-conductor device.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EFI</sourceid><recordid>eNqVjEEKwjAQRbtxIeodZitYSLWge1F6APdlaKZtIJ0JmVT09kbpBVx8_ufxeetCGvQyEJd9JDpAGEVz4qw_AL3HicpICaNFToD2idyRBQryekMkdQzINmdBnUxB1CUnnDcndOx4gDQSaHZti1WPXmm39KbY32-Pa1POGjARJ20xBO86_Bq0PRpTm6oyl3N9-uf7AfrWSj4</recordid><startdate>20040610</startdate><enddate>20040610</enddate><creator>Chiou, Kuo-Chan</creator><creator>Lee, Tzong-Ming</creator><creator>Tseng, Feng-Po</creator><creator>Liao, Lu-Shih</creator><creator>Huang, Jia-Chi</creator><creator>Lin, Tzu-Ting</creator><scope>EFI</scope></search><sort><creationdate>20040610</creationdate><title>Halogen-free, phosphorus-free flame-retardant advanced epoxy resin and an epoxy composition containing the same</title><author>Chiou, Kuo-Chan ; Lee, Tzong-Ming ; Tseng, Feng-Po ; Liao, Lu-Shih ; Huang, Jia-Chi ; Lin, Tzu-Ting</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_applications_200401108743</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2004</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Chiou, Kuo-Chan</creatorcontrib><creatorcontrib>Lee, Tzong-Ming</creatorcontrib><creatorcontrib>Tseng, Feng-Po</creatorcontrib><creatorcontrib>Liao, Lu-Shih</creatorcontrib><creatorcontrib>Huang, Jia-Chi</creatorcontrib><creatorcontrib>Lin, Tzu-Ting</creatorcontrib><collection>USPTO Published Applications</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Chiou, Kuo-Chan</au><au>Lee, Tzong-Ming</au><au>Tseng, Feng-Po</au><au>Liao, Lu-Shih</au><au>Huang, Jia-Chi</au><au>Lin, Tzu-Ting</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Halogen-free, phosphorus-free flame-retardant advanced epoxy resin and an epoxy composition containing the same</title><date>2004-06-10</date><risdate>2004</risdate><abstract>A halogen-free, phosphorus-free poly-cyclic compound is used a flame retardant. This compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin. The advanced epoxy resin together with an inorganic additive are mixed with an epoxy resin to form a halogen-free, phosphorus-free flame-retardant epoxy composition, which can be used in the manufacture of a printed circuit board and as an encapsulation material for a semi-conductor device.</abstract><oa>free_for_read</oa></addata></record>
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title Halogen-free, phosphorus-free flame-retardant advanced epoxy resin and an epoxy composition containing the same
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-28T18%3A11%3A42IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFI&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Chiou,%20Kuo-Chan&rft.date=2004-06-10&rft_id=info:doi/&rft_dat=%3Cuspatents_EFI%3E20040110874%3C/uspatents_EFI%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true