Methods and apparatuses for analyzing solder plating solutions
The present invention relates to methods and apparatus for determining concentrations of various inorganic or organic components in solder plating solutions, which include titration or parallel titration methods, direct potentiometry methods, calibration methods, and/or UV-Vis absorption analysis.
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| creator | King, Mackenzie Robertson, Peter Hilgarth, Monica Schomburg, Cory Tolmachev, Yuriy Schoenrogge, Uwe |
| description | The present invention relates to methods and apparatus for determining concentrations of various inorganic or organic components in solder plating solutions, which include titration or parallel titration methods, direct potentiometry methods, calibration methods, and/or UV-Vis absorption analysis. |
| format | Patent |
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| source | USPTO Published Applications |
| title | Methods and apparatuses for analyzing solder plating solutions |
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