Low-K dielectric structure and method

Low-K dielectric structure and method

A low-k dielectric sacrificial material is formed within a microelectronic structure covered with a suitable porous or low density permeable material. At an appropriate time, the underlying sacrificial material is decomposed and diffused away through the overlying permeable material. As a result, at...

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Hauptverfasser: Morrow, Xiaorong, Kloster, Grant, Leu, Jihperng
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Sprache:eng
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creator Morrow, Xiaorong
Kloster, Grant
Leu, Jihperng
description A low-k dielectric sacrificial material is formed within a microelectronic structure covered with a suitable porous or low density permeable material. At an appropriate time, the underlying sacrificial material is decomposed and diffused away through the overlying permeable material. As a result, at least one void is created, contributing to desirable dielectric characteristics.
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