Circuit substrate and fabrication method thereof

Circuit substrate and fabrication method thereof

A circuit substrate includes a board, a plurality of metal layers and an insulator. The board has a plurality of conductive traces layers and a via formed therein. The metal layers are formed on the inner wall of the via and each of the metal layers is electrically connected to its corresponding con...

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Hauptverfasser: Hung, Chih-Pin, Ou, In-De, Chen, Chia-Shang, Lin, Kuang-Hua, Chao, Shin-Hua
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Sprache:eng
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creator Hung, Chih-Pin
Ou, In-De
Chen, Chia-Shang
Lin, Kuang-Hua
Chao, Shin-Hua
description A circuit substrate includes a board, a plurality of metal layers and an insulator. The board has a plurality of conductive traces layers and a via formed therein. The metal layers are formed on the inner wall of the via and each of the metal layers is electrically connected to its corresponding conductive traces layer. The via is filled with the insulator so that each of the metal layers is electrically isolated from each other. In addition, this invention also provides a fabrication method of the circuit substrate.
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title Circuit substrate and fabrication method thereof
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