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The present invention provides a circuit board in which peeling strength is prevented from decreasing and connection resistance to conductive material is prevented from increasing, though the contact area decreases when the circuit board has a copper foil. This circuit board has metal film ( 105 ) f...
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| Hauptverfasser: | , |
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| Format: | Patent |
| Sprache: | eng |
| Online-Zugang: | Volltext bestellen |
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| Zusammenfassung: | The present invention provides a circuit board in which peeling strength is prevented from decreasing and connection resistance to conductive material is prevented from increasing, though the contact area decreases when the circuit board has a copper foil. This circuit board has metal film (
105
) for covering a through hole on at least one surface of insulating substrate (
101
) having the through hole filled with conductive material (
104
). Uneven layer (
1069
with a thickness of 5 m or more is formed on a surface of metal film (
105
), and a metal layer is formed on the opposite surface to uneven layer (
106
). |
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