Programmable capacitor associated with an input/output pad

The present invention provides a method and apparatus for a programmable capacitor associated with an input/output pad in the semiconductor device. The apparatus includes a semiconductor die having an upper surface, a first capacitor deployed above the upper surface of the semiconductor die, a separ...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Quinlan, Sion, Almond, Bryan, Hunt, Ken, Lever, Andrew, Ward, Joe
Format: Patent
Sprache:eng
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Quinlan, Sion
Almond, Bryan
Hunt, Ken
Lever, Andrew
Ward, Joe
description The present invention provides a method and apparatus for a programmable capacitor associated with an input/output pad in the semiconductor device. The apparatus includes a semiconductor die having an upper surface, a first capacitor deployed above the upper surface of the semiconductor die, a separation layer deployed above the first capacitor, and a bond pad deployed above the separation layer such that at least a portion of the bond pad lies above the first capacitor.
format Patent
fullrecord <record><control><sourceid>uspatents_EFI</sourceid><recordid>TN_cdi_uspatents_applications_20040041245</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>20040041245</sourcerecordid><originalsourceid>FETCH-uspatents_applications_200400412453</originalsourceid><addsrcrecordid>eNrjZLAKKMpPL0rMzU1MyklVSE4sSEzOLMkvUkgsLs5PzkwsSU1RKM8syVBIzFPIzCsoLdHPLy0BUgoFiSk8DKxpiTnFqbxQmptB0801xNlDt7S4AKgxr6Q4PrGgICczObEkMz-vON7IwMAEiAyNTEyNSVELADfINlw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Programmable capacitor associated with an input/output pad</title><source>USPTO Published Applications</source><creator>Quinlan, Sion ; Almond, Bryan ; Hunt, Ken ; Lever, Andrew ; Ward, Joe</creator><creatorcontrib>Quinlan, Sion ; Almond, Bryan ; Hunt, Ken ; Lever, Andrew ; Ward, Joe</creatorcontrib><description>The present invention provides a method and apparatus for a programmable capacitor associated with an input/output pad in the semiconductor device. The apparatus includes a semiconductor die having an upper surface, a first capacitor deployed above the upper surface of the semiconductor die, a separation layer deployed above the first capacitor, and a bond pad deployed above the separation layer such that at least a portion of the bond pad lies above the first capacitor.</description><language>eng</language><creationdate>2004</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20040041245$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,873,885,64059</link.rule.ids><linktorsrc>$$Uhttps://patentcenter.uspto.gov/applications/10230795$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Quinlan, Sion</creatorcontrib><creatorcontrib>Almond, Bryan</creatorcontrib><creatorcontrib>Hunt, Ken</creatorcontrib><creatorcontrib>Lever, Andrew</creatorcontrib><creatorcontrib>Ward, Joe</creatorcontrib><title>Programmable capacitor associated with an input/output pad</title><description>The present invention provides a method and apparatus for a programmable capacitor associated with an input/output pad in the semiconductor device. The apparatus includes a semiconductor die having an upper surface, a first capacitor deployed above the upper surface of the semiconductor die, a separation layer deployed above the first capacitor, and a bond pad deployed above the separation layer such that at least a portion of the bond pad lies above the first capacitor.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2004</creationdate><recordtype>patent</recordtype><sourceid>EFI</sourceid><recordid>eNrjZLAKKMpPL0rMzU1MyklVSE4sSEzOLMkvUkgsLs5PzkwsSU1RKM8syVBIzFPIzCsoLdHPLy0BUgoFiSk8DKxpiTnFqbxQmptB0801xNlDt7S4AKgxr6Q4PrGgICczObEkMz-vON7IwMAEiAyNTEyNSVELADfINlw</recordid><startdate>20040304</startdate><enddate>20040304</enddate><creator>Quinlan, Sion</creator><creator>Almond, Bryan</creator><creator>Hunt, Ken</creator><creator>Lever, Andrew</creator><creator>Ward, Joe</creator><scope>EFI</scope></search><sort><creationdate>20040304</creationdate><title>Programmable capacitor associated with an input/output pad</title><author>Quinlan, Sion ; Almond, Bryan ; Hunt, Ken ; Lever, Andrew ; Ward, Joe</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_applications_200400412453</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2004</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Quinlan, Sion</creatorcontrib><creatorcontrib>Almond, Bryan</creatorcontrib><creatorcontrib>Hunt, Ken</creatorcontrib><creatorcontrib>Lever, Andrew</creatorcontrib><creatorcontrib>Ward, Joe</creatorcontrib><collection>USPTO Published Applications</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Quinlan, Sion</au><au>Almond, Bryan</au><au>Hunt, Ken</au><au>Lever, Andrew</au><au>Ward, Joe</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Programmable capacitor associated with an input/output pad</title><date>2004-03-04</date><risdate>2004</risdate><abstract>The present invention provides a method and apparatus for a programmable capacitor associated with an input/output pad in the semiconductor device. The apparatus includes a semiconductor die having an upper surface, a first capacitor deployed above the upper surface of the semiconductor die, a separation layer deployed above the first capacitor, and a bond pad deployed above the separation layer such that at least a portion of the bond pad lies above the first capacitor.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_uspatents_applications_20040041245
source USPTO Published Applications
title Programmable capacitor associated with an input/output pad
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-19T01%3A13%3A31IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFI&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=Quinlan,%20Sion&rft.date=2004-03-04&rft_id=info:doi/&rft_dat=%3Cuspatents_EFI%3E20040041245%3C/uspatents_EFI%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true