Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same

Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same

A system for testing a collection of device chips by temporarily attaching them to a carrier having a plurality of receptacles with microdendritic features; the receptacles matching with and pushed in contact with a matching set of contact pads on the device chips; said carrier additionally having t...

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Hauptverfasser: Magerlein, John, McKnight, Samuel, Petrarca, Kevin, Purushothaman, Sampath, Sambucetti, Carlos, Van Horn, Joseph, Volant, Richard, Walker, George
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Sprache:eng
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creator Magerlein, John
McKnight, Samuel
Petrarca, Kevin
Purushothaman, Sampath
Sambucetti, Carlos
Van Horn, Joseph
Volant, Richard
Walker, George
description A system for testing a collection of device chips by temporarily attaching them to a carrier having a plurality of receptacles with microdendritic features; the receptacles matching with and pushed in contact with a matching set of contact pads on the device chips; said carrier additionally having test pads connected to the receptacles through interconnect wiring. The system allows connecting the chips together and testing the collection as a whole by probing the test pads on the carrier. Burn-in of the collection of chips can also be performed on the temporary carrier, which is reusable.
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title Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same
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