Resin sheet, thermoformed resin article, and laminate structure
Disclosed is a resin sheet having a resin layer comprising a copolymer of ethylene and/or -olefin and a vinyl compound (I) defined below or a vinyl compound (II) defined below: Vinyl compound (I): A vinyl compound represented by CH 2 CH.R, wherein the substituent R has a steric parameter Es of not l...
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| creator | Higashi, Kenichi Oi, Nobuo |
| description | Disclosed is a resin sheet having a resin layer comprising a copolymer of ethylene and/or -olefin and a vinyl compound (I) defined below or a vinyl compound (II) defined below:
Vinyl compound (I): A vinyl compound represented by CH
2
CH.R, wherein the substituent R has a steric parameter Es of not larger than −1.64 and a steric parameter B1 of not smaller than 1.53;
Vinyl compound (II): A vinyl compound represented by CH
2
CH.R′, wherein the substituent R′ is a secondary alkyl group or a tertiary alkyl group. |
| format | Patent |
| fullrecord | <record><control><sourceid>uspatents_EFI</sourceid><recordid>TN_cdi_uspatents_applications_20030072958</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>20030072958</sourcerecordid><originalsourceid>FETCH-uspatents_applications_200300729583</originalsourceid><addsrcrecordid>eNqVyj0KwkAQQOFtLCR6h2mFCEuCGCsLiViLfRg2E7Kwf8zM3l8RL2D1ivdtzfVJ4hPISqQt6Eoc85I50gz8PcjqXaAWMM0QMPqESiDK1Wll2pnNgkFo_2tjDvfxdXscq5QPTCoTlhK8Q_U5ydRZ21t77i6nof_HvgE_wzgQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Resin sheet, thermoformed resin article, and laminate structure</title><source>USPTO Published Applications</source><creator>Higashi, Kenichi ; Oi, Nobuo</creator><creatorcontrib>Higashi, Kenichi ; Oi, Nobuo</creatorcontrib><description>Disclosed is a resin sheet having a resin layer comprising a copolymer of ethylene and/or -olefin and a vinyl compound (I) defined below or a vinyl compound (II) defined below:
Vinyl compound (I): A vinyl compound represented by CH
2
CH.R, wherein the substituent R has a steric parameter Es of not larger than −1.64 and a steric parameter B1 of not smaller than 1.53;
Vinyl compound (II): A vinyl compound represented by CH
2
CH.R′, wherein the substituent R′ is a secondary alkyl group or a tertiary alkyl group.</description><language>eng</language><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20030072958$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,873,885,64057</link.rule.ids><linktorsrc>$$Uhttps://patentcenter.uspto.gov/applications/10254655$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Higashi, Kenichi</creatorcontrib><creatorcontrib>Oi, Nobuo</creatorcontrib><title>Resin sheet, thermoformed resin article, and laminate structure</title><description>Disclosed is a resin sheet having a resin layer comprising a copolymer of ethylene and/or -olefin and a vinyl compound (I) defined below or a vinyl compound (II) defined below:
Vinyl compound (I): A vinyl compound represented by CH
2
CH.R, wherein the substituent R has a steric parameter Es of not larger than −1.64 and a steric parameter B1 of not smaller than 1.53;
Vinyl compound (II): A vinyl compound represented by CH
2
CH.R′, wherein the substituent R′ is a secondary alkyl group or a tertiary alkyl group.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EFI</sourceid><recordid>eNqVyj0KwkAQQOFtLCR6h2mFCEuCGCsLiViLfRg2E7Kwf8zM3l8RL2D1ivdtzfVJ4hPISqQt6Eoc85I50gz8PcjqXaAWMM0QMPqESiDK1Wll2pnNgkFo_2tjDvfxdXscq5QPTCoTlhK8Q_U5ydRZ21t77i6nof_HvgE_wzgQ</recordid><startdate>20030417</startdate><enddate>20030417</enddate><creator>Higashi, Kenichi</creator><creator>Oi, Nobuo</creator><scope>EFI</scope></search><sort><creationdate>20030417</creationdate><title>Resin sheet, thermoformed resin article, and laminate structure</title><author>Higashi, Kenichi ; Oi, Nobuo</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_applications_200300729583</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Higashi, Kenichi</creatorcontrib><creatorcontrib>Oi, Nobuo</creatorcontrib><collection>USPTO Published Applications</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Higashi, Kenichi</au><au>Oi, Nobuo</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Resin sheet, thermoformed resin article, and laminate structure</title><date>2003-04-17</date><risdate>2003</risdate><abstract>Disclosed is a resin sheet having a resin layer comprising a copolymer of ethylene and/or -olefin and a vinyl compound (I) defined below or a vinyl compound (II) defined below:
Vinyl compound (I): A vinyl compound represented by CH
2
CH.R, wherein the substituent R has a steric parameter Es of not larger than −1.64 and a steric parameter B1 of not smaller than 1.53;
Vinyl compound (II): A vinyl compound represented by CH
2
CH.R′, wherein the substituent R′ is a secondary alkyl group or a tertiary alkyl group.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| source | USPTO Published Applications |
| title | Resin sheet, thermoformed resin article, and laminate structure |
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