Wafer dicing device and method
Methods and devices for cutting workpieces, which include a laser adapted to at least partially cut a workpiece, are described. The workpiece is a wafer having a plurality dies each with an integrated circuit. A mechanical cutter follows the laser and engages the workpiece. An embodiment of the mech...
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| creator | Tan, Kian Shing Peng, Neo Chee Chye, Chew Beng Chuan, Tan Hock Wai, Fong Chun |
| description | Methods and devices for cutting workpieces, which include a laser adapted to at least partially cut a workpiece, are described. The workpiece is a wafer having a plurality dies each with an integrated circuit. A mechanical cutter follows the laser and engages the workpiece. An embodiment of the mechanical cutter includes a cutting blade adapted to complete a cut through a workpiece. A method includes a two-pass cutting procedure. The first pass is made by a laser, which scribes the workpiece. The second pass is made by the mechanical cutter. In an embodiment, the mechanical cutter follows the scribe created by the laser. In an embodiment, the workpiece is supported by a table. The workpiece moves relative to the laser and the mechanical cutter. |
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| fullrecord | <record><control><sourceid>uspatents_EFI</sourceid><recordid>TN_cdi_uspatents_applications_20030047543</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>20030047543</sourcerecordid><originalsourceid>FETCH-uspatents_applications_200300475433</originalsourceid><addsrcrecordid>eNrjZJALT0xLLVJIyUzOzEtXSEkty0xOVUjMS1HITS3JyE_hYWBNS8wpTuWF0twMmm6uIc4euqXFBYklqXklxfGJBQU5mcmJJZn5ecXxRgYGxgYGJuamJsbGpKgFAKlAKxQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Wafer dicing device and method</title><source>USPTO Published Applications</source><creator>Tan, Kian Shing ; Peng, Neo Chee ; Chye, Chew Beng ; Chuan, Tan Hock ; Wai, Fong Chun</creator><creatorcontrib>Tan, Kian Shing ; Peng, Neo Chee ; Chye, Chew Beng ; Chuan, Tan Hock ; Wai, Fong Chun</creatorcontrib><description>Methods and devices for cutting workpieces, which include a laser adapted to at least partially cut a workpiece, are described. The workpiece is a wafer having a plurality dies each with an integrated circuit. A mechanical cutter follows the laser and engages the workpiece. An embodiment of the mechanical cutter includes a cutting blade adapted to complete a cut through a workpiece. A method includes a two-pass cutting procedure. The first pass is made by a laser, which scribes the workpiece. The second pass is made by the mechanical cutter. In an embodiment, the mechanical cutter follows the scribe created by the laser. In an embodiment, the workpiece is supported by a table. The workpiece moves relative to the laser and the mechanical cutter.</description><language>eng</language><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20030047543$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,873,885,64059</link.rule.ids><linktorsrc>$$Uhttps://patentcenter.uspto.gov/applications/10118666$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Tan, Kian Shing</creatorcontrib><creatorcontrib>Peng, Neo Chee</creatorcontrib><creatorcontrib>Chye, Chew Beng</creatorcontrib><creatorcontrib>Chuan, Tan Hock</creatorcontrib><creatorcontrib>Wai, Fong Chun</creatorcontrib><title>Wafer dicing device and method</title><description>Methods and devices for cutting workpieces, which include a laser adapted to at least partially cut a workpiece, are described. The workpiece is a wafer having a plurality dies each with an integrated circuit. A mechanical cutter follows the laser and engages the workpiece. An embodiment of the mechanical cutter includes a cutting blade adapted to complete a cut through a workpiece. A method includes a two-pass cutting procedure. The first pass is made by a laser, which scribes the workpiece. The second pass is made by the mechanical cutter. In an embodiment, the mechanical cutter follows the scribe created by the laser. In an embodiment, the workpiece is supported by a table. The workpiece moves relative to the laser and the mechanical cutter.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EFI</sourceid><recordid>eNrjZJALT0xLLVJIyUzOzEtXSEkty0xOVUjMS1HITS3JyE_hYWBNS8wpTuWF0twMmm6uIc4euqXFBYklqXklxfGJBQU5mcmJJZn5ecXxRgYGxgYGJuamJsbGpKgFAKlAKxQ</recordid><startdate>20030313</startdate><enddate>20030313</enddate><creator>Tan, Kian Shing</creator><creator>Peng, Neo Chee</creator><creator>Chye, Chew Beng</creator><creator>Chuan, Tan Hock</creator><creator>Wai, Fong Chun</creator><scope>EFI</scope></search><sort><creationdate>20030313</creationdate><title>Wafer dicing device and method</title><author>Tan, Kian Shing ; Peng, Neo Chee ; Chye, Chew Beng ; Chuan, Tan Hock ; Wai, Fong Chun</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_applications_200300475433</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Tan, Kian Shing</creatorcontrib><creatorcontrib>Peng, Neo Chee</creatorcontrib><creatorcontrib>Chye, Chew Beng</creatorcontrib><creatorcontrib>Chuan, Tan Hock</creatorcontrib><creatorcontrib>Wai, Fong Chun</creatorcontrib><collection>USPTO Published Applications</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Tan, Kian Shing</au><au>Peng, Neo Chee</au><au>Chye, Chew Beng</au><au>Chuan, Tan Hock</au><au>Wai, Fong Chun</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Wafer dicing device and method</title><date>2003-03-13</date><risdate>2003</risdate><abstract>Methods and devices for cutting workpieces, which include a laser adapted to at least partially cut a workpiece, are described. The workpiece is a wafer having a plurality dies each with an integrated circuit. A mechanical cutter follows the laser and engages the workpiece. An embodiment of the mechanical cutter includes a cutting blade adapted to complete a cut through a workpiece. A method includes a two-pass cutting procedure. The first pass is made by a laser, which scribes the workpiece. The second pass is made by the mechanical cutter. In an embodiment, the mechanical cutter follows the scribe created by the laser. In an embodiment, the workpiece is supported by a table. The workpiece moves relative to the laser and the mechanical cutter.</abstract><oa>free_for_read</oa></addata></record> |
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| source | USPTO Published Applications |
| title | Wafer dicing device and method |
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