Extrusion-free wet cleaning process for copper-dual damascene structures

An extrusion-free wet cleaning process for post-etch Cu-dual damascene structures is developed. The process includes the following steps: (1). providing a wafer having a silicon substrate and at least one post-etch Cu-dual damascene structure, the post-etch Cu-dual damascene structure having a via s...

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Bibliographische Detailangaben

1. Verfasser:	Wu, Chih-Ning
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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