Deformation-absorbing leadframe for semiconductor devices

A leadframe structure for use with an integrated circuit chip, comprising a chip mount pad having an area smaller than said chip intended for mounting; a plurality of support members, each attached externally to the perimeter of said pad and internally to said leadframe; and each said support member...

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Bibliographische Detailangaben

Hauptverfasser:	Alvarado, Reynante, Arguelles, Ronaldo, Rimpillo, Leonardo, Weygan, Teddy
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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