Stackable valve manifold arrangement
A stackable valve manifold arrangement including a first valve manifold adapted to operatively receive a plurality of valves. The first valve manifold having an upper surface. A second valve manifold is provided which is adapted to operatively receive a plurality of valves. The second valve manifold...
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creator | Bogdanowicz, Grzegorz Latino, Frank Forster, Karl-Heinz |
description | A stackable valve manifold arrangement including a first valve manifold adapted to operatively receive a plurality of valves. The first valve manifold having an upper surface. A second valve manifold is provided which is adapted to operatively receive a plurality of valves. The second valve manifold has a lower surface that is in opposed relationship to the upper surface of the first valve manifold, and the second valve manifold is in fluid communication with the first manifold. The first and second manifolds may each be joined to a circuit board forming a module. The modules are vertically stackable and operatively connected to each other to form a system. |
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The first valve manifold having an upper surface. A second valve manifold is provided which is adapted to operatively receive a plurality of valves. The second valve manifold has a lower surface that is in opposed relationship to the upper surface of the first valve manifold, and the second valve manifold is in fluid communication with the first manifold. The first and second manifolds may each be joined to a circuit board forming a module. The modules are vertically stackable and operatively connected to each other to form a system.</description><language>eng</language><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20020174905$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,873,885,64058</link.rule.ids><linktorsrc>$$Uhttps://patentcenter.uspto.gov/applications/10124894$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Bogdanowicz, Grzegorz</creatorcontrib><creatorcontrib>Latino, Frank</creatorcontrib><creatorcontrib>Forster, Karl-Heinz</creatorcontrib><title>Stackable valve manifold arrangement</title><description>A stackable valve manifold arrangement including a first valve manifold adapted to operatively receive a plurality of valves. The first valve manifold having an upper surface. A second valve manifold is provided which is adapted to operatively receive a plurality of valves. The second valve manifold has a lower surface that is in opposed relationship to the upper surface of the first valve manifold, and the second valve manifold is in fluid communication with the first manifold. The first and second manifolds may each be joined to a circuit board forming a module. The modules are vertically stackable and operatively connected to each other to form a system.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EFI</sourceid><recordid>eNrjZFAJLklMzk5MyklVKEvMKUtVyE3My0zLz0lRSCwqSsxLT81NzSvhYWBNS8wpTuWF0twMmm6uIc4euqXFBYklQAXF8YkFBTmZyYklmfl5xfFGBgZGBobmJpYGpsakqAUALEAt_Q</recordid><startdate>20021128</startdate><enddate>20021128</enddate><creator>Bogdanowicz, Grzegorz</creator><creator>Latino, Frank</creator><creator>Forster, Karl-Heinz</creator><scope>EFI</scope></search><sort><creationdate>20021128</creationdate><title>Stackable valve manifold arrangement</title><author>Bogdanowicz, Grzegorz ; Latino, Frank ; Forster, Karl-Heinz</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_applications_200201749053</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Bogdanowicz, Grzegorz</creatorcontrib><creatorcontrib>Latino, Frank</creatorcontrib><creatorcontrib>Forster, Karl-Heinz</creatorcontrib><collection>USPTO Published Applications</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Bogdanowicz, Grzegorz</au><au>Latino, Frank</au><au>Forster, Karl-Heinz</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Stackable valve manifold arrangement</title><date>2002-11-28</date><risdate>2002</risdate><abstract>A stackable valve manifold arrangement including a first valve manifold adapted to operatively receive a plurality of valves. The first valve manifold having an upper surface. A second valve manifold is provided which is adapted to operatively receive a plurality of valves. The second valve manifold has a lower surface that is in opposed relationship to the upper surface of the first valve manifold, and the second valve manifold is in fluid communication with the first manifold. The first and second manifolds may each be joined to a circuit board forming a module. The modules are vertically stackable and operatively connected to each other to form a system.</abstract><oa>free_for_read</oa></addata></record> |
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title | Stackable valve manifold arrangement |
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