Method for packaging a microelectronic device using on-die bond pad expansion

Expanded bond pads are formed over a passivation layer on a semiconductor wafer before the wafer is diced into individual circuit chips. After dicing, the individual chips are packaged by fixing each chip within a package core and building up one or more metallization layers on the resulting assembl...

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Hauptverfasser:	Towle, Steven, Jones, Martha, Vu, Quat
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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