Method for packaging an image sensor
A packaging structure of an image sensor includes a plurality of metal sheets, a photosensitive chip, and transparent glue. Each of the metal sheets has a first surface and a second surface. The photosensitive chip is electrically connecting to the plurality of first surfaces of the metal sheets. Th...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A packaging structure of an image sensor includes a plurality of metal sheets, a photosensitive chip, and transparent glue. Each of the metal sheets has a first surface and a second surface. The photosensitive chip is electrically connecting to the plurality of first surfaces of the metal sheets. The transparent glue is for covering the metal sheets and the photosensitive chip is capable of receiving optical signals. The second surfaces of the metal sheets bonded by the transparent glue are exposed to the outside so as to form signal output terminals for the image sensor. A method for packaging the structure is also disclosed. |
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