Polymer, process for production, composition for film formation containing the same, method of film formation, and insulating film

a composition for film formation which can be cured in a short time period and give a film having a low dielectric constant and excellent in heat resistance, adhesion and cracking resistance, a polymer for use in the composition and a process for producing the polymer. The composition prepared by di...

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Bibliographische Detailangaben

Hauptverfasser:	Okada, Takashi, Sinohara, Noriyasu, Shirato, Kaori, Ebisawa, Masahiko, Nishikawa, Michinori, Yamada, Kinji
Format:	Patent
Sprache:	eng
Online-Zugang:	Volltext bestellen
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