FLIP CHIP ATTACH ON FLEXIBLE CIRCUIT CARRIER USING CHIP WITH METALLIC CAP ON SOLDER
A structure and method is disclosed for directly attaching a device or package on flexible organic circuit carriers having low cost and high reliability. IC chips with a new solder interconnect structure, comprised of a layer of pure tin, deposited on the top of high melting Pb-Sn solder balls are e...
Gespeichert in:
Hauptverfasser: | , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
container_end_page | |
---|---|
container_issue | |
container_start_page | |
container_title | |
container_volume | |
creator | DALAL, HORMAZDYAR M FALLON, KENNETH M GAUDENZI, GENE J MILKOVICH, CYNTHIA S |
description | A structure and method is disclosed for directly attaching a device or package on flexible organic circuit carriers having low cost and high reliability.
IC chips with a new solder interconnect structure, comprised of a layer of pure tin, deposited on the top of high melting Pb-Sn solder balls are employed for joining.
These methods, techniques and metallurgical structures enables direct attachment of electronic devices of any complexity to any substrate and to any level of packaging hierarchy.
Also, devices or packages having other joining technologies, eg. SMT, BGA, TBGA, etc. could be joined onto the flexible circuit carrier. |
format | Patent |
fullrecord | <record><control><sourceid>uspatents_EFI</sourceid><recordid>TN_cdi_uspatents_applications_20010013423</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>20010013423</sourcerecordid><originalsourceid>FETCH-uspatents_applications_200100134233</originalsourceid><addsrcrecordid>eNrjZAh28_EMUHD2ABKOISGOzh4K_n4Kbj6uEZ5OPq4Kzp5BzqGeIQrOjkFBnq5BCqHBnn7uENXhniEeCr6uIY4-Pp7OQAUBII3B_j4urkE8DKxpiTnFqbxQmptB0801xNlDt7S4ILEkNa-kOD6xoCAnMzmxJDM_rzjeyMDAEIiMTYyMjUlRCwBGUzY8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>FLIP CHIP ATTACH ON FLEXIBLE CIRCUIT CARRIER USING CHIP WITH METALLIC CAP ON SOLDER</title><source>USPTO Published Applications</source><creator>DALAL, HORMAZDYAR M ; FALLON, KENNETH M ; GAUDENZI, GENE J ; MILKOVICH, CYNTHIA S</creator><creatorcontrib>DALAL, HORMAZDYAR M ; FALLON, KENNETH M ; GAUDENZI, GENE J ; MILKOVICH, CYNTHIA S</creatorcontrib><description>A structure and method is disclosed for directly attaching a device or package on flexible organic circuit carriers having low cost and high reliability.
IC chips with a new solder interconnect structure, comprised of a layer of pure tin, deposited on the top of high melting Pb-Sn solder balls are employed for joining.
These methods, techniques and metallurgical structures enables direct attachment of electronic devices of any complexity to any substrate and to any level of packaging hierarchy.
Also, devices or packages having other joining technologies, eg. SMT, BGA, TBGA, etc. could be joined onto the flexible circuit carrier.</description><language>eng</language><creationdate>2001</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20010013423$$EPDF$$P50$$Guspatents$$Hfree_for_read</linktopdf><link.rule.ids>230,308,780,873,885,64059</link.rule.ids><linktorsrc>$$Uhttps://patentcenter.uspto.gov/applications/08932864$$EView_record_in_USPTO$$FView_record_in_$$GUSPTO$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DALAL, HORMAZDYAR M</creatorcontrib><creatorcontrib>FALLON, KENNETH M</creatorcontrib><creatorcontrib>GAUDENZI, GENE J</creatorcontrib><creatorcontrib>MILKOVICH, CYNTHIA S</creatorcontrib><title>FLIP CHIP ATTACH ON FLEXIBLE CIRCUIT CARRIER USING CHIP WITH METALLIC CAP ON SOLDER</title><description>A structure and method is disclosed for directly attaching a device or package on flexible organic circuit carriers having low cost and high reliability.
IC chips with a new solder interconnect structure, comprised of a layer of pure tin, deposited on the top of high melting Pb-Sn solder balls are employed for joining.
These methods, techniques and metallurgical structures enables direct attachment of electronic devices of any complexity to any substrate and to any level of packaging hierarchy.
Also, devices or packages having other joining technologies, eg. SMT, BGA, TBGA, etc. could be joined onto the flexible circuit carrier.</description><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2001</creationdate><recordtype>patent</recordtype><sourceid>EFI</sourceid><recordid>eNrjZAh28_EMUHD2ABKOISGOzh4K_n4Kbj6uEZ5OPq4Kzp5BzqGeIQrOjkFBnq5BCqHBnn7uENXhniEeCr6uIY4-Pp7OQAUBII3B_j4urkE8DKxpiTnFqbxQmptB0801xNlDt7S4ILEkNa-kOD6xoCAnMzmxJDM_rzjeyMDAEIiMTYyMjUlRCwBGUzY8</recordid><startdate>20010816</startdate><enddate>20010816</enddate><creator>DALAL, HORMAZDYAR M</creator><creator>FALLON, KENNETH M</creator><creator>GAUDENZI, GENE J</creator><creator>MILKOVICH, CYNTHIA S</creator><scope>EFI</scope></search><sort><creationdate>20010816</creationdate><title>FLIP CHIP ATTACH ON FLEXIBLE CIRCUIT CARRIER USING CHIP WITH METALLIC CAP ON SOLDER</title><author>DALAL, HORMAZDYAR M ; FALLON, KENNETH M ; GAUDENZI, GENE J ; MILKOVICH, CYNTHIA S</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-uspatents_applications_200100134233</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2001</creationdate><toplevel>online_resources</toplevel><creatorcontrib>DALAL, HORMAZDYAR M</creatorcontrib><creatorcontrib>FALLON, KENNETH M</creatorcontrib><creatorcontrib>GAUDENZI, GENE J</creatorcontrib><creatorcontrib>MILKOVICH, CYNTHIA S</creatorcontrib><collection>USPTO Published Applications</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DALAL, HORMAZDYAR M</au><au>FALLON, KENNETH M</au><au>GAUDENZI, GENE J</au><au>MILKOVICH, CYNTHIA S</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>FLIP CHIP ATTACH ON FLEXIBLE CIRCUIT CARRIER USING CHIP WITH METALLIC CAP ON SOLDER</title><date>2001-08-16</date><risdate>2001</risdate><abstract>A structure and method is disclosed for directly attaching a device or package on flexible organic circuit carriers having low cost and high reliability.
IC chips with a new solder interconnect structure, comprised of a layer of pure tin, deposited on the top of high melting Pb-Sn solder balls are employed for joining.
These methods, techniques and metallurgical structures enables direct attachment of electronic devices of any complexity to any substrate and to any level of packaging hierarchy.
Also, devices or packages having other joining technologies, eg. SMT, BGA, TBGA, etc. could be joined onto the flexible circuit carrier.</abstract><oa>free_for_read</oa></addata></record> |
fulltext | fulltext_linktorsrc |
identifier | |
ispartof | |
issn | |
language | eng |
recordid | cdi_uspatents_applications_20010013423 |
source | USPTO Published Applications |
title | FLIP CHIP ATTACH ON FLEXIBLE CIRCUIT CARRIER USING CHIP WITH METALLIC CAP ON SOLDER |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-24T12%3A08%3A34IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-uspatents_EFI&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=DALAL,%20HORMAZDYAR%20M&rft.date=2001-08-16&rft_id=info:doi/&rft_dat=%3Cuspatents_EFI%3E20010013423%3C/uspatents_EFI%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |