Laminates having a buffer layer and cover layer

The invention relates to a laminate with, one after the other, amorphous or polycrystalline substrate, a textured buffer layer, and an oriented thin layer. In addition, at least one cover layer is contained between the buffer layer and the thin layer. In a method for producing laminate, a buffer lay...

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Hauptverfasser: Bauer, Markus, Kinder, Helmut, Schwachulla, Joachim
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creator Bauer, Markus
Kinder, Helmut
Schwachulla, Joachim
description The invention relates to a laminate with, one after the other, amorphous or polycrystalline substrate, a textured buffer layer, and an oriented thin layer. In addition, at least one cover layer is contained between the buffer layer and the thin layer. In a method for producing laminate, a buffer layer is applied to a substrate, with the buffer layer material being evaporated from the buffer layer material dispensing devices at an angle 1 ≠0 at the normal to the substrate surface onto the latter, before an oriented thin layer is evaporated. According to the invention, provision is made such that (a) following evaporation of the buffer layer and prior to the evaporation of the oriented thin layer, at least one cover layer is evaporated under deposition conditions that vary from those under which the buffer layer was applied, especially at a different pressure, different temperature, different rate, and/or different angle 2 ≠ 1 , especially 2 < 1 , preferably a 2 0 to the substrate surface normal, and/or is evaporated on the buffer layer in such fashion that the buffer layer has a biaxial texture and/or facets, and/or (b) the buffer layer material and possibly the cover layer material and/or the material for the oriented thin layer are applied by thermal evaporation, especially electron beam evaporation, and/or (c) angle 1 is larger, especially slightly larger, than an angle that a crystal axis of the buffer layer material forms with the substrate surface normal, with an additional crystal axis of the buffer layer material being parallel to the substrate surface and/or (d) a higher pressure prevails in the vicinity of the application of the buffer layer material and possibly the cover layer material and/or the material for the oriented thin layer on the respective substrate, said pressure being higher than the remaining vacuum conditions and/or (e) volatile components and/or components required for producing the buffer layer and possibly the cover layer and/or the oriented thin layer is/are added in gas form and/or as reactive components to the respective substrate in the vicinity of the application of the buffer layer material and possibly of the cover layer material and/or of the material for the oriented thin layer, during evaporation of the respective material or materials. In addition, the invention provides devices for producing laminates in conjunction with the devices suitable for the method outlined above.
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In addition, at least one cover layer is contained between the buffer layer and the thin layer. In a method for producing laminate, a buffer layer is applied to a substrate, with the buffer layer material being evaporated from the buffer layer material dispensing devices at an angle 1 ≠0 at the normal to the substrate surface onto the latter, before an oriented thin layer is evaporated. According to the invention, provision is made such that (a) following evaporation of the buffer layer and prior to the evaporation of the oriented thin layer, at least one cover layer is evaporated under deposition conditions that vary from those under which the buffer layer was applied, especially at a different pressure, different temperature, different rate, and/or different angle 2 ≠ 1 , especially 2 &lt; 1 , preferably a 2 0 to the substrate surface normal, and/or is evaporated on the buffer layer in such fashion that the buffer layer has a biaxial texture and/or facets, and/or (b) the buffer layer material and possibly the cover layer material and/or the material for the oriented thin layer are applied by thermal evaporation, especially electron beam evaporation, and/or (c) angle 1 is larger, especially slightly larger, than an angle that a crystal axis of the buffer layer material forms with the substrate surface normal, with an additional crystal axis of the buffer layer material being parallel to the substrate surface and/or (d) a higher pressure prevails in the vicinity of the application of the buffer layer material and possibly the cover layer material and/or the material for the oriented thin layer on the respective substrate, said pressure being higher than the remaining vacuum conditions and/or (e) volatile components and/or components required for producing the buffer layer and possibly the cover layer and/or the oriented thin layer is/are added in gas form and/or as reactive components to the respective substrate in the vicinity of the application of the buffer layer material and possibly of the cover layer material and/or of the material for the oriented thin layer, during evaporation of the respective material or materials. 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In addition, at least one cover layer is contained between the buffer layer and the thin layer. In a method for producing laminate, a buffer layer is applied to a substrate, with the buffer layer material being evaporated from the buffer layer material dispensing devices at an angle 1 ≠0 at the normal to the substrate surface onto the latter, before an oriented thin layer is evaporated. According to the invention, provision is made such that (a) following evaporation of the buffer layer and prior to the evaporation of the oriented thin layer, at least one cover layer is evaporated under deposition conditions that vary from those under which the buffer layer was applied, especially at a different pressure, different temperature, different rate, and/or different angle 2 ≠ 1 , especially 2 &lt; 1 , preferably a 2 0 to the substrate surface normal, and/or is evaporated on the buffer layer in such fashion that the buffer layer has a biaxial texture and/or facets, and/or (b) the buffer layer material and possibly the cover layer material and/or the material for the oriented thin layer are applied by thermal evaporation, especially electron beam evaporation, and/or (c) angle 1 is larger, especially slightly larger, than an angle that a crystal axis of the buffer layer material forms with the substrate surface normal, with an additional crystal axis of the buffer layer material being parallel to the substrate surface and/or (d) a higher pressure prevails in the vicinity of the application of the buffer layer material and possibly the cover layer material and/or the material for the oriented thin layer on the respective substrate, said pressure being higher than the remaining vacuum conditions and/or (e) volatile components and/or components required for producing the buffer layer and possibly the cover layer and/or the oriented thin layer is/are added in gas form and/or as reactive components to the respective substrate in the vicinity of the application of the buffer layer material and possibly of the cover layer material and/or of the material for the oriented thin layer, during evaporation of the respective material or materials. 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In addition, at least one cover layer is contained between the buffer layer and the thin layer. In a method for producing laminate, a buffer layer is applied to a substrate, with the buffer layer material being evaporated from the buffer layer material dispensing devices at an angle 1 ≠0 at the normal to the substrate surface onto the latter, before an oriented thin layer is evaporated. According to the invention, provision is made such that (a) following evaporation of the buffer layer and prior to the evaporation of the oriented thin layer, at least one cover layer is evaporated under deposition conditions that vary from those under which the buffer layer was applied, especially at a different pressure, different temperature, different rate, and/or different angle 2 ≠ 1 , especially 2 &lt; 1 , preferably a 2 0 to the substrate surface normal, and/or is evaporated on the buffer layer in such fashion that the buffer layer has a biaxial texture and/or facets, and/or (b) the buffer layer material and possibly the cover layer material and/or the material for the oriented thin layer are applied by thermal evaporation, especially electron beam evaporation, and/or (c) angle 1 is larger, especially slightly larger, than an angle that a crystal axis of the buffer layer material forms with the substrate surface normal, with an additional crystal axis of the buffer layer material being parallel to the substrate surface and/or (d) a higher pressure prevails in the vicinity of the application of the buffer layer material and possibly the cover layer material and/or the material for the oriented thin layer on the respective substrate, said pressure being higher than the remaining vacuum conditions and/or (e) volatile components and/or components required for producing the buffer layer and possibly the cover layer and/or the oriented thin layer is/are added in gas form and/or as reactive components to the respective substrate in the vicinity of the application of the buffer layer material and possibly of the cover layer material and/or of the material for the oriented thin layer, during evaporation of the respective material or materials. In addition, the invention provides devices for producing laminates in conjunction with the devices suitable for the method outlined above.</abstract><oa>free_for_read</oa></addata></record>
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title Laminates having a buffer layer and cover layer
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