APPARATUS FOR BONDING CHIP BAND AND METHOD FOR BONDING CHIP USING THE SAME
A chip bonding apparatus, includes: a body; a substrate conveyor installed on the body to transfer a substrate; a bonding head conveyor disposed on an upper surface of the body; an alignment unit installed on the body and adjusting a position of the substrate and a position of a chip; and a bonding...
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| Format: | Patent |
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| Sprache: | eng |
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