METHOD FOR MANUFACTURING A THREE-DIMENSIONAL LTCC PACKAGE STRUCTURE
A method includes the steps of: a) providing an interposer, wherein the interposer has a chamber therein, multiple chip I/O contacts are formed in the chamber, and the chip I/O contacts are connected to connecting wires disposed in the interposer through transmission wires in the interposer; b) plac...
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| Sprache: | eng |
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