Stamp For Hot or Cold Stamping

A stamp die having a surface structure for hot or cold stamping is described, said stamp die being flexible such that it is no longer necessary during stamping to make the hitherto necessary adjustments for tolerance compensation by placing suitable materials under the substrate to be stamped or under the stamp die. Said flexibility is obtained in that the stamp die has a use layer with the surface structure, a base layer and at least one intermediate layer between the use layer and the base layer ( and ), the layers each being connected to one another by means of a heat-resistant flexible connecting film. Said connecting films are preferably adhesive films.